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Laser flip-chip mounting for passive alignment and high-frequency modulation
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1996 (English)In: Optical Communication, 1996. ECOC ’96. 22nd European Conference on, 1996, Vol. 1, 103-106 p.Conference paper (Refereed)
Abstract [en]

We have developed a silicon motherboard for flip-chip mounting of lasers in a way that is compatible with high-frequency modulation (24 GHz) and which allows passive alignment of the lasers to single-mode fibres.

Place, publisher, year, edition, pages
1996. Vol. 1, 103-106 p.
Keyword [en]
24 GHz;broadband access networks;high-frequency modulation;laser flip-chip mounting;optical transmitters;passive alignment;semiconductor lasers;silicon motherboard;single-mode fibre/laser coupling;electro-optical modulation;flip-chip devices;integrated optoelectronics;optical fibre couplers;optical transmitters;optical workshop techniques;silicon;
National Category
Telecommunications Atom and Molecular Physics and Optics
URN: urn:nbn:se:kth:diva-89289OAI: diva2:503009
European Conference on Optical Communication
NR 20140805Available from: 2012-02-14 Created: 2012-02-14 Last updated: 2012-02-14Bibliographically approved

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Kjebon, OlleSchatz, Richard
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ReferencesLink to record
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