Laser flip-chip mounting for passive alignment and high-frequency modulation
1996 (English)In: Optical Communication, 1996. ECOC ’96. 22nd European Conference on, 1996, Vol. 1, 103-106 p.Conference paper (Refereed)
We have developed a silicon motherboard for flip-chip mounting of lasers in a way that is compatible with high-frequency modulation (24 GHz) and which allows passive alignment of the lasers to single-mode fibres.
Place, publisher, year, edition, pages
1996. Vol. 1, 103-106 p.
24 GHz;broadband access networks;high-frequency modulation;laser flip-chip mounting;optical transmitters;passive alignment;semiconductor lasers;silicon motherboard;single-mode fibre/laser coupling;electro-optical modulation;flip-chip devices;integrated optoelectronics;optical fibre couplers;optical transmitters;optical workshop techniques;silicon;
Telecommunications Atom and Molecular Physics and Optics
IdentifiersURN: urn:nbn:se:kth:diva-89289OAI: oai:DiVA.org:kth-89289DiVA: diva2:503009
European Conference on Optical Communication
NR 201408052012-02-142012-02-142012-02-14Bibliographically approved