Change search
ReferencesLink to record
Permanent link

Direct link
Very compact FTTH Diplexer design using advanced wafer level fabrication methods
Show others and affiliations
2008 (English)In: MICRO-OPTICS 2008  : Proceedings of SPIE - The International Society for Optical Engineering, Strasbourg, 2008, Vol. 6992Conference paper (Refereed)
Abstract [en]

FTTH networks require implementing a diplexer at each user termination. According to most of the standards, this diplexer detects a download signal beam at 1.49ÎŒm and emits an upload signal beam at 1.31ÎŒm on the same single mode fibre. Both signals exhibit datarate speed below 2.5Gbps. Today, most of the diplexers are obtained by actively aligning a set of individual optoelectronic components and micro-optics. However, new manufacturing solutions satisfying very low cost and mass production capability requirements of this market would help to speed the massive spreading of this technology. In this paper, we present an original packaging design to manufacture Diplexer Optical Sub-Assembly for FTTH application. A dual photodiode is stacked over a VCSEL and detects both the download signal beam at 1.49ÎŒm passing through the laser and one part of the upload signal beam at 1.31ÎŒm for monitoring. To satisfy this approach, an innovative VCSEL has been designed to have a very high transmission at 1.49ÎŒm. All these components are mounted on a very small circuit board on glass including also integrated circuits such as transimpedance amplifier. So, the device combines advanced optoelectronic components and highly integrated Multi-Chip-Module on glass approach using collective wafer-level assembling technologies. For the single mode fibre optical coupling, active and passive alignment solutions are considered.

Place, publisher, year, edition, pages
Strasbourg, 2008. Vol. 6992
, Micro-Optics 2008, ISSN 0277-786X
Keyword [en]
Diplexer, FTTH, Optical interconnects, Packaging, VCSEL, Amplifiers (electronic), Architectural design, Chip scale packages, Computer networks, Differential amplifiers, Electronic equipment manufacture, Electronics industry, Glass, Integrated circuits, Manufacture, Metropolitan area networks, Microelectronics, Network protocols, Networks (circuits), Optical design, Optics, Pulsed laser deposition, Single mode fibers, Standards, Surface emitting lasers, Technology, (OTDR) technology, Diplexers, Fiber-to-the-home (FTTH) application, Filber-to-the-home (FTTH) networks, High transmission, Highly integrated, Individual (PSS 544-7), Low costs, Manufacturing solutions, Mass production, Micro-optics, Multi chip module (MCM), Optical couplings, Optical Sub-Assembly (OSA), Optoelectronic components, Packaging designs, Passive alignment, Signal beams, Single mode fibres, Trans-impedance amplifier (TIA), Wafer level fabrication, Wafer levels, Multiplexing equipment
National Category
Condensed Matter Physics
URN: urn:nbn:se:kth:diva-82997DOI: 10.1117/12.779746ISI: 000257877100002ScopusID: 2-s2.0-45149086068OAI: diva2:503120
Conference on Micro-Optics Location: Strasbourg, FRANCE Date: APR 07-09, 2008
QC 20120301Available from: 2012-02-15 Created: 2012-02-12 Last updated: 2012-03-01Bibliographically approved

Open Access in DiVA

No full text

Other links

Publisher's full textScopus

Search in DiVA

By author/editor
Berggren, Jesper
Condensed Matter Physics

Search outside of DiVA

GoogleGoogle Scholar
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

Altmetric score

Total: 46 hits
ReferencesLink to record
Permanent link

Direct link