Change search
ReferencesLink to record
Permanent link

Direct link
Wafer-Level Via-First 3D Integration with Hybrid-Bonding of Cu/BCB Redistribution Layers
Center for Integrated Electronics Rensselaer Polytechnic Institute Troy, New York, U.S.A..ORCID iD: 0000-0002-0525-8647
Show others and affiliations
2005 (English)Conference paper (Other academic)
Abstract [en]

Three-dimensional (3D) integration with through-die viasoffer improved electrical performance compared to edgeconnectedwire bonds in stacked-die assemblies for wirelessapplications. Monolithic wafer-level 3D integration offersthe potential for a high density of micron-sized through-dievias necessary for highest performance memory stacks,microprocessors with large L2 caches and ASICs with largeembedded memories. In addition, such wafer-leveltechnologies offer the potential of lowest cost in largemanufacturing volume of any heterogeneous integrationplatform, incorporating the inherent low cost of monolithicIC interconnectivity.

After a brief summary of current wafer-level 3D integrationplatforms, a recently introduced platform that offers theprocess integration advantage of copper-to-copper (Cu-to-Cu) bonding with the increased adhesion strength andenvironmental robustness of dielectric adhesive bondingusing benzocyclobutene (BCB) is discussed. Criticalprocessing challenges of the new platform include BCBpartial curing compatible with damascene patterning, postdamascene-patterning cleaning and surface activation,bonding process parameters, and wafer-level planarizationrequirements. The inherent incorporation of a redistributionlayer into the bonding layer process further reduces theprocess flow and is compatible with wafer-level packaging(WLP) technologies.

Place, publisher, year, edition, pages
Keyword [en]
3D, high-density interconnect, wafer-level, redistribution layers
National Category
Engineering and Technology
URN: urn:nbn:se:kth:diva-91420OAI: diva2:510019
IWLPC - International Wafer-Level Packaging Conference. San Jose (CA). November 3-4, 2005.
QC 20120328Available from: 2012-03-14 Created: 2012-03-14 Last updated: 2012-03-28Bibliographically approved

Open Access in DiVA

No full text

Search in DiVA

By author/editor
Niklaus, Frank
Engineering and Technology

Search outside of DiVA

GoogleGoogle Scholar
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

Total: 51 hits
ReferencesLink to record
Permanent link

Direct link