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Use of Expandable Handle Substrate for Wafer-Level Transfer of Dies in Heterogeneous Integration and Packaging of MEMS
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-9820-8728
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0441-6893
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0001-9552-4234
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2011 (English)In: WaferBond´11, 2011, 105-106 p.Conference paper, Published paper (Other academic)
Place, publisher, year, edition, pages
2011. 105-106 p.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-91421OAI: oai:DiVA.org:kth-91421DiVA: diva2:510020
Conference
Waferbond Conference 2011. Chemnitz, Germany. 6th-8th December 2011
Note
QC 20120328Available from: 2012-03-14 Created: 2012-03-14 Last updated: 2012-03-28Bibliographically approved

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Forsberg, FredrikHaraldsson, TommyStemme, GöranNiklaus, Frank

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