Change search
ReferencesLink to record
Permanent link

Direct link
Handbook of Wafer Bonding
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0002-0525-8647
2012 (English)In: Polymer Adhesive Wafer Bonding / [ed] P. Ramm, J.-Q. Lu, M.M.V. Taklo, Wiley-VCH Verlagsgesellschaft, 2012Chapter in book (Other academic)
Place, publisher, year, edition, pages
Wiley-VCH Verlagsgesellschaft, 2012.
National Category
Engineering and Technology
URN: urn:nbn:se:kth:diva-91423OAI: diva2:510022

QC 20130111

Available from: 2012-03-14 Created: 2012-03-14 Last updated: 2013-01-11Bibliographically approved

Open Access in DiVA

No full text

Search in DiVA

By author/editor
Niklaus, Frank
By organisation
Microsystem Technology (Changed name 20121201)
Engineering and Technology

Search outside of DiVA

GoogleGoogle Scholar
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

Total: 74 hits
ReferencesLink to record
Permanent link

Direct link