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Handbook of Wafer Bonding
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0002-0525-8647
2012 (English)In: Polymer Adhesive Wafer Bonding / [ed] P. Ramm, J.-Q. Lu, M.M.V. Taklo, Wiley-VCH Verlagsgesellschaft, 2012Chapter in book (Other academic)
Place, publisher, year, edition, pages
Wiley-VCH Verlagsgesellschaft, 2012.
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Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-91423OAI: oai:DiVA.org:kth-91423DiVA: diva2:510022
Note

QC 20130111

Available from: 2012-03-14 Created: 2012-03-14 Last updated: 2013-01-11Bibliographically approved

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Niklaus, Frank

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CiteExportLink to record
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