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KTH Introduces New TSV-Concept with Wire-Bonded Metal Cores
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0003-3452-6361
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0001-9552-4234
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0002-0525-8647
2009 (English)Other (Other (popular science, discussion, etc.))
Place, publisher, year, pages
Yole Development, 2009.
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Engineering and Technology
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URN: urn:nbn:se:kth:diva-91424OAI: oai:DiVA.org:kth-91424DiVA: diva2:510023
Note

NV 20150330

Available from: 2012-03-14 Created: 2012-03-14 Last updated: 2015-03-30Bibliographically approved

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Fischer, Andreas C.Stemme, GöranNiklaus, Frank

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