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Reactive Diffusion at the Liquid Al/Solid Cu Interface in a High Magnetic Field
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2011 (English)In: Materials and Manufacturing Processes, ISSN 1042-6914, E-ISSN 1532-2475, Vol. 26, no 6, 821-825 p.Article in journal (Refereed) Published
Abstract [en]

The kinetics of the reactive diffusion at the liquid Al/solid Cu interface was investigated at T = 973 K, 1023 K, and 1073K in a high magnetic field of 11.5 T. During the annealing process, three stable compounds (delta, xi(2), and eta(2)) layers were formed at the interface of the couples, and a power function relationship between the mean thickness of the diffusion layers and the annealing time kept stable. Without magnetic field, the exponent of the power function for each compound layer was higher than 0.5, but it was close to or even smaller than 0.5 with a magnetic field. Compared with the field-free environment, the migration of the liquid/solid interface due to interdiffusion decreased in the presence of a magnetic field. A considerable decrease in the effective diffusion coefficient under a magnetic field provided a likely explanation for the experimental results.

Place, publisher, year, edition, pages
2011. Vol. 26, no 6, 821-825 p.
Keyword [en]
High magnetic field, Interface, Liquid metal, Reactive diffusion
National Category
Materials Engineering
URN: urn:nbn:se:kth:diva-92405DOI: 10.1080/10426914.2010.515642ISI: 000299576500003ScopusID: 2-s2.0-79959572819OAI: diva2:515369
QC 20120412Available from: 2012-04-12 Created: 2012-04-02 Last updated: 2012-04-12Bibliographically approved

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Nakajima, Keiji
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Applied Process Metallurgy
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