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high aspect ratio tsvs fabricated by magnetic self-assembly of gold-coated nickel wires
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0003-3452-6361
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-4867-0391
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0441-6893
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2012 (English)In: Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, IEEE conference proceedings, 2012, 541-547 p.Conference paper, Published paper (Refereed)
Abstract [en]

Three-dimensional (3D) integration is an emerging technologythat vertically interconnects stacked dies of electronics and/orMEMS-based transducers using through silicon vias (TSVs).TSVs enable the realization of devices with shorter signal lengths,smaller packages and lower parasitic capacitances, which can resultin higher performance and lower costs of the system. Inthis paper we demonstrate a new manufacturing technology forhigh-aspect ratio (> 8) through silicon metal vias using magneticself-assembly of gold-coated nickel rods inside etched throughsilicon-via holes. The presented TSV fabrication technique enablesthrough-wafer vias with high aspect ratios and superior electricalcharacteristics. This technique eliminates common issues inTSV fabrication using conventional approaches, such as the metaldeposition and via insulation and hence it has the potential to reducesignificantly the production costs of high-aspect ratio stateof-the-art TSVs for e.g. interposer, MEMS and RF applications.

Place, publisher, year, edition, pages
IEEE conference proceedings, 2012. 541-547 p.
Series
Electronic Components & Technology Conference. Proceedings, ISSN 0569-5503
Keyword [en]
Through-Silicon, Wafer, 3d, Technology, Vias, Lsis
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-93494DOI: 10.1109/ECTC.2012.6248882ISI: 000309162000086Scopus ID: 2-s2.0-84866328428ISBN: 978-­1-­4673-­1965-­2 (print)OAI: oai:DiVA.org:kth-93494DiVA: diva2:516584
Conference
62nd Electronic Components and Technology Conference (ECTC), May 29 - June 1, 2012, San Diego, CA
Note

© 2012 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

QC 20120618

Available from: 2012-06-18 Created: 2012-04-18 Last updated: 2012-11-30Bibliographically approved

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Fischer, Andreas C.Bleiker, Simon J.Haraldsson, TommyStemme, GöranNiklaus, Frank

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