Batch Transfer of Radially Expanded Die Arrays for Heterogeneous Integration Using Different Wafer Sizes
2012 (English)In: Journal of microelectromechanical systems, ISSN 1057-7157, E-ISSN 1941-0158, Vol. 21, no 5, 1077-1083 p.Article in journal (Refereed) Published
This paper reports on the realization of a novel method for batch transfer of multiple separate dies from a smaller substrate onto a larger wafer substrate by using a standard matrix expander in combination with an elastic dicing tape and adhesive wafer bonding. We demonstrate the expansion and transfer of about 30 000 dies from a 100-mm wafer format to a 200-mm wafer. Furthermore, multiple expansions of 100-mm wafers diced into 60 000 dies are evaluated to determine the position accuracy between different expansions. Fabrication, evaluation method, and results are presented.
Place, publisher, year, edition, pages
2012. Vol. 21, no 5, 1077-1083 p.
Stretchable electronics, flexible substrate, heterogeneous integration
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject SRA - ICT
IdentifiersURN: urn:nbn:se:kth:diva-95430DOI: 10.1109/JMEMS.2012.2203105ISI: 000309731400010ScopusID: 2-s2.0-84867098549OAI: oai:DiVA.org:kth-95430DiVA: diva2:528309
FunderEU, European Research Council, 267528
QC 201211162012-05-242012-05-242013-10-03Bibliographically approved