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Batch Transfer of Radially Expanded Die Arrays for Heterogeneous Integration Using Different Wafer Sizes
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-9820-8728
KTH, School of Electrical Engineering (EES), Microsystem Technology.
KTH, School of Electrical Engineering (EES), Microsystem Technology.ORCID iD: 0000-0002-0441-6893
KTH, School of Electrical Engineering (EES), Microsystem Technology.
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2012 (English)In: Journal of microelectromechanical systems, ISSN 1057-7157, E-ISSN 1941-0158, Vol. 21, no 5, 1077-1083 p.Article in journal (Refereed) Published
Abstract [en]

This paper reports on the realization of a novel method for batch transfer of multiple separate dies from a smaller substrate onto a larger wafer substrate by using a standard matrix expander in combination with an elastic dicing tape and adhesive wafer bonding. We demonstrate the expansion and transfer of about 30 000 dies from a 100-mm wafer format to a 200-mm wafer. Furthermore, multiple expansions of 100-mm wafers diced into 60 000 dies are evaluated to determine the position accuracy between different expansions. Fabrication, evaluation method, and results are presented.

Place, publisher, year, edition, pages
2012. Vol. 21, no 5, 1077-1083 p.
Keyword [en]
Stretchable electronics, flexible substrate, heterogeneous integration
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
SRA - ICT
Identifiers
URN: urn:nbn:se:kth:diva-95430DOI: 10.1109/JMEMS.2012.2203105ISI: 000309731400010Scopus ID: 2-s2.0-84867098549OAI: oai:DiVA.org:kth-95430DiVA: diva2:528309
Funder
EU, European Research Council, 267528
Note

QC 20121116

Available from: 2012-05-24 Created: 2012-05-24 Last updated: 2017-12-07Bibliographically approved
In thesis
1. Heterogeneous material integration for MEMS
Open this publication in new window or tab >>Heterogeneous material integration for MEMS
2013 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

This thesis describes heterogeneous integration methods for the fabrication of microelectromechanical systems (MEMS). Most MEMS devices reuse the fabrication techniques that are found in the microelectronics integrated circuit industry. This limits the selection of materials and processes that are feasible for the realization of MEMS devices. Heterogeneous integration methods, on the other hand, consist of the separate pre-fabrication of sub-components followed by an assembly step. The pre-fabrication of subcomponents opens up for a wider selection of fabrication technologies and thus potentially better performing and more optimized devices. The first part of the thesis is focused upon an adhesive wafer-level layer transfer method to fabricate resistive microbolometer-based long-wavelength infrared focal plane arrays. This is realized by a CMOS-compatible transfer of monocrystalline silicon with epitaxially grown silicon-germanium quantum wells. Heterogeneous transfer methods are also used for the realization of filtering devices, integration of distributed small dies onto larger wafer formats and to fabricate a graphene-based pressure sensor. The filtering devices consist of very fragile nano-porous membranes that with the presented dry adhesive methods can be transferred without clogging or breaking. Pick-and-place methods for the massive transfer of small dies between different wafer formats are limited by time and die size-considerations. Our presented solution solves these problems by expanding a die array on a flexible tape, followed by adhesive wafer bonding to a target wafer. Furthermore, a gauge pressure sensor is realized by transferring a graphene monolayer grown on a copper foil to a micromachined target wafer with a silicon oxide interface layer. This device is used to extract the gauge factor of graphene. Adhesive bonding is an enabling technology for the presented heterogeneous integration techniques. A blister test method together with an experimental setup to characterize the bond energies between adhesives and bonded substrates is also presented.

Place, publisher, year, edition, pages
Stockholm: KTH Royal Institute of Technology, 2013. xii, 87 p.
Series
Trita-EE, ISSN 1653-5146 ; 2013:039
National Category
Engineering and Technology
Identifiers
urn:nbn:se:kth:diva-129185 (URN)
Public defence
2013-10-25, Kollegiesalen, Brinellvägen 8, KTH, Stockholm, 10:00 (English)
Opponent
Supervisors
Note

QC 20131003

Available from: 2013-10-03 Created: 2013-09-22 Last updated: 2013-10-04Bibliographically approved

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Forsberg, FredrikHaraldsson, TommyStemme, GöranNiklaus, Frank

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