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A method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0003-3452-6361
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0001-9552-4234
2010 (English)Patent (Other (popular science, discussion, etc.))
Abstract [en]

A method for forming conductive vias in a substrate (302) by filling preformed via holes (303-305), preferably through via holes, with conductive material, comprises providing a plurality of preformed objects at least partly comprising ferromagnetic material (301) on a surface of the substrate; providing a magnetic source (307) on an opposite side of the substrate with respect to the plurality of preformed objects, thereby at least partly aligning at least a portion of the preformed objects with a magnetic field associated with the magnetic source; and moving the magnetic source relative the substrate, or vice versa, thereby moving the at least portion of the preformed objects into at least a portion of the via holes.

Place, publisher, year, edition, pages
2010.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-98059OAI: oai:DiVA.org:kth-98059DiVA: diva2:534804
Patent
SE WO 2012071002A1
Note

QS 2015

Available from: 2012-06-18 Created: 2012-06-18 Last updated: 2015-01-19Bibliographically approved

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Fischer, Andreas C.Niklaus, FrankStemme, Göran

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