Mechanically tri-stable SPDT metal-contact MEMS switch embedded in 3D transmission line
2007 (English)In: European Microwave Week 2007 Conference Proceedings, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007, IEEE , 2007, 153-156 p.Conference paper (Refereed)
This paper presents an electrostatically actuated MEMS switch mechanism for a mechanically tri-stable singlepole-double-throw (SPDT) metal-contact switch, which is fully embedded in the signal line of a low-loss 3D-micromachined coplanar-waveguide T-junction. The switch features mechanical tri-stability, i.e. all three stable states of the switch are maintained by an interlocking mechanism without applying external actuation energy. The actuation voltage is only necessary for triggering the transition between the three stable states. In contrast to conventional MEMS switch designs where the switch actuator is built around the transmission line and thus creates a discontinuity in the waveguide, the switch mechanism of the presented design is completely embedded in the signal line of the coplanar waveguide. This, together with a 3D micromachined transmission line design confining the major part of the field lines in the air and not in the substrate, results in very low insertion loss and low reflections. Furthermore, the switches feature active opening which results in very reliable operation of the switches. Single-pole-double-throw metal-contact switches have been fabricated in a very simple, single photolitography mask process, and successfully evaluated from DC to 15 GRz.
Place, publisher, year, edition, pages
IEEE , 2007. 153-156 p.
Bandpass filters, Composite micromechanics, Electric lines, Electric switches, Electronics industry, Electrostatic actuators, Integrated circuits, Machine design, Mechanisms, MEMS, Metals, Microelectromechanical devices, Microstrip lines, Microwave circuits, Microwave integrated circuits, Microwaves, Optical design, Photoresists, Poles, Power transmission, Transmission line theory, Waveguides
Other Electrical Engineering, Electronic Engineering, Information Engineering Telecommunications
IdentifiersURN: urn:nbn:se:kth:diva-101886DOI: 10.1109/EMICC.2007.4412740ISI: 000255223100040ScopusID: 2-s2.0-48149098235ISBN: 978-2-87487-002-6OAI: oai:DiVA.org:kth-101886DiVA: diva2:552867
European Microwave Week 2007, EuMW 2007 - 2nd European Microwave Integrated Circuits Conference, EuMIC 2007; Munich; Germany; 8 October 2007 through 12 October 2007
QC 201209172012-09-172012-09-052014-11-28Bibliographically approved