Modeling of peak-to-peak core switching noise, output impedance, and decoupling capacitance along a vertical chain of power distribution TSV pairs
2012 (English)In: Analog Integrated Circuits and Signal Processing, ISSN 0925-1030, E-ISSN 1573-1979, Vol. 73, no 1, 311-328 p.Article in journal (Refereed) Published
In this article we propose an efficient and accurate model to estimate peak-to-peak core switching noise, caused by simultaneous switching of logic loads along a vertical chain of power distribution TSV pairs in a 3D stack of dies interconnected through TSVs. The proposed model is accurate with only a 2–3% difference in peak-to-peak core switching noise as compared to the Ansoft Nexxim4.1 equivalent model. The proposed model is 3–4 times faster than Ansoft Nexxim4.1 and uses two times less memory as compared to the Ansoft Nexxim4.1 equivalent model. In this article we also thoroughly establish design guidelines for almost flat output impedance magnitude at each stage of a vertical chain of power distribution TSV pairs to realize a resonance free scenario over a wide operating frequency range. We also establish decoupling capacitance design guidelines based on the optimum output impedance and critically damped supply voltage for the core logic for each stage of a vertical chain of power distribution TSV pairs.
Place, publisher, year, edition, pages
2012. Vol. 73, no 1, 311-328 p.
Core switching noise, 3D stack of dies, Vertical chain, Power distribution TSV pairs
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-103556DOI: 10.1007/s10470-011-9797-0ISI: 000309130700032ScopusID: 2-s2.0-84866731975OAI: oai:DiVA.org:kth-103556DiVA: diva2:560460
FunderEU, FP7, Seventh Framework Programme, FP7-ICT-215030
QC 201210152012-10-152012-10-152012-11-30Bibliographically approved