Peak-to-peak Switching Noise and LC Resonance on a Power Distribution TSV Pair
2010 (English)In: 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, 173-176 p.Article in journal (Refereed) Published
How peak-to-peak switching noise as well as the LC resonance term varies by varying different circuit parameters of a power distribution TSV pair (having decoupling capacitance and logic load), within a 3D stack of ICs interconnected through TSVs.
Place, publisher, year, edition, pages
2010. 173-176 p.
3D stack of ICs, LC resonance, Peak-to-peak noise
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-103559DOI: 10.1109/EPEPS.2010.5642574ScopusID: 2-s2.0-78650935583OAI: oai:DiVA.org:kth-103559DiVA: diva2:560473
QC 201210152012-10-152012-10-152012-10-15Bibliographically approved