Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Switching Noise in 3D Power Distribution Networks: an Overview
KTH, School of Information and Communication Technology (ICT), Electronic Systems.
KTH, School of Information and Communication Technology (ICT), Electronic Systems.
2012 (English)In: VLSI  design / [ed] Esteban Tlelo-Cuautle, Sheldon Tan, Intech , 2012, 209-224 p.Chapter in book (Refereed)
Place, publisher, year, edition, pages
Intech , 2012. 209-224 p.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-103561ISBN: 978-953-307-884-7 (print)OAI: oai:DiVA.org:kth-103561DiVA: diva2:560477
Note

QC 20121015

Available from: 2012-10-15 Created: 2012-10-15 Last updated: 2012-10-15Bibliographically approved
In thesis
1. Core Switching Noise for On-Chip 3D Power Distribution Networks
Open this publication in new window or tab >>Core Switching Noise for On-Chip 3D Power Distribution Networks
2012 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Reducing the interconnect size with each technology node and increasing speed with each generation increases IR-drop and Ldi/dt noise. In addition to this, the drive for more integration increases the average current requirement for modern ULSI design. Simultaneous switching of core logic blocks and I/O drivers produces large current transients due to power distribution network parasitics at high clock frequency. The current transients are injected into the power distribution planes thereby inducing noise in the supply voltage. The part of the noise that is caused by switching of the internal logic load is core switching noise. The core logic switches at much higher speed than driver speed whereas the package inductance is less than the on-chip inductance in modern BGA packages. The core switching noise is currently gaining more attention for three-dimensional integrated circuits where on-chip inductance is much higher than the board and package inductance due to smaller board, and package. The switching noise of the driver is smaller than the core switching noise due to small driver size and reduced capacitance associated with short on-board wires for three-dimensional integrated circuits. The load increases with the addition of each die. The power distribution TSV pairs to supply each extra die also introduce additional parasitic. The core switching noise may propagate through substrate and consequently through interconnecting TSVs to different dies in heterogeneous integrated system. Core switching noise may lead to decreased device drive capability, increased gate delays, logic errors, and reduced noise margins. The actual behavior of the on-chip load is not well known in the beginning of the design cycle whereas altering the design during later stages is not cost effective. The size of a three-dimensional power distribution network may reach billions of nodes with the addition of dies in a vertical stack. The traditional tools may run out of time and memory during simulation of a three-dimensional power distribution network whereas, the CAD tools for the analysis of 3D power distribution network are in the process of evolution. Compact mathematical models for the estimation of core switching noise are necessary in order to overcome the power integrity challenges associated with the 3D power distribution network design. This thesis presents three different mathematical models to estimate core switching noise for 3D stacked power distribution networks. A time-domain-based mathematical model for the estimation of design parameters of a power distribution TSV pair is also proposed. Design guidelines for the estimation of optimum decoupling capacitance based on flat output impedance are also proposed for each stage of the vertical chain of power distribution TSV pairs. A mathematical model for tradeoff between TSV resistance and amount of decoupling capacitance on each DRAM die is proposed for a 3D-DRAM-Over-Logic system. The models are developed by following a three step approach: 1) design physical model, 2) convert it to equivalent electrical model, and 3) formulate the mathematical model based on the electrical model. The accuracy, speed and memory requirement of the proposed mathematical model is compared with equivalent Ansoft Nexxim models.

Place, publisher, year, edition, pages
Stockholm: KTH Royal Institute of Technology, 2012. xxviii, 108 p.
Series
Trita-ICT-ECS AVH, ISSN 1653-6363 ; 12:06
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:kth:diva-103566 (URN)978-91-7501-519-4 (ISBN)
Public defence
2012-11-07, Sal/Hal Sal E, Forum, KTH-ICT, Isafjordsgatan 39, Kista, 09:00 (English)
Opponent
Supervisors
Note

QC 20121015

Available from: 2012-10-15 Created: 2012-10-15 Last updated: 2012-10-15Bibliographically approved

Open Access in DiVA

No full text

Search in DiVA

By author/editor
Ahmad, WaqarTenhunen, Hannu
By organisation
Electronic Systems
Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar

isbn
urn-nbn

Altmetric score

isbn
urn-nbn
Total: 59 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf