Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration
2013 (English)In: Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, IEEE conference proceedings, 2013, 342-346 p.Conference paper (Refereed)
We demonstrate, for the first time, the use of off stoichiometry thiolene-epoxy, OSTE(+) for adhesive wafer bonding. The dual cure system, with an initial UV-curing step followed by a second thermal cure, allows for high bond strength and potentially high quality material interfaces. We show that cured OSTE(+) is easily removed in oxygen plasma and that the characteristics of OSTE(+) make it a potential candidate for use in heterogeneous 3D MEMS integration. Furthermore, we show how the bond energies of wafers bonded with OSTE(+) adhesive compares with the bond energies of wafers bonded with Cyclotene 3022-46 (BCB) and mr-I 9150XP nanoimprint resist.
Place, publisher, year, edition, pages
IEEE conference proceedings, 2013. 342-346 p.
, Proceedings IEEE Micro Electro Mechanical Systems, ISSN 1084-6999
OSTE(+), Heterogeneous integration, Wafer bonding
Engineering and Technology
Research subject SRA - ICT
IdentifiersURN: urn:nbn:se:kth:diva-104070DOI: 10.1109/MEMSYS.2013.6474248ISI: 000320549200088ScopusID: 2-s2.0-84875443694ISBN: 978-1-4673-5654-1OAI: oai:DiVA.org:kth-104070DiVA: diva2:562935
IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013; Taipei; Taiwan; 20 January 2013 through 24 January 2013
QC 201303222013-03-222012-10-262013-08-15Bibliographically approved