Integration of microwave MEMS devices into rectangular waveguide with conductive polymer interposers
2013 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 23, no 12, 125020- p.Article in journal (Refereed) Published
This paper investigates a novel method of integrating microwave microelectromechanical systems (MEMS) chips into millimeter-wave rectangular waveguides. The fundamental difficulties of merging micromachined with macromachined microwave components, in particular, surface topography, roughness, mechanical stress points and air gaps interrupting the surface currents, are overcome by a double-side adhesive conductive polymer interposer. This interposer provides a uniform electrical contact, stable mechanical connection and a compliant stress distribution interlayer between the MEMS chip and a waveguide frame. The integration method is successfully implemented both for prototype devices of MEMS-tuneable reflective metamaterial surfaces and for MEMS reconfigurable transmissive surfaces. The measured insertion loss of the novel conductive polymer interface is less than 0.4 dB in the E-band (60-90 GHz), as compared to a conventional assembly with an air gap of 2.5 dB loss. Moreover, both dc biasing lines and mechanical feedthroughs to actuators outside the waveguide are demonstrated in this paper, which is achieved by structuring the polymer sheet xurographically. Finite element method simulations were carried out for analyzing the influence of different parameters on the radio frequency performance.
Place, publisher, year, edition, pages
2013. Vol. 23, no 12, 125020- p.
waveguide integration, conductive polymer interposer, microwave MEMS, RF MEMS
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-104311DOI: 10.1088/0960-1317/23/12/125020ISI: 000327437000020ScopusID: 2-s2.0-84889026540OAI: oai:DiVA.org:kth-104311DiVA: diva2:563796
FunderEU, FP7, Seventh Framework Programme, 224197
QC 20140113. Updated from accepted to published.2012-10-312012-10-312014-03-17Bibliographically approved