Dielectric breakdown strength of alumina filled poly (ethylene-co-butyl acrylate) nanocomposites
2012 (English)In: 2012 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), IEEE , 2012, 323-326 p.Conference paper (Refereed)
Dielectric breakdown strength of poly (ethylene-co-butyl acrylate) (EBA) nanocomposites filled with spherical alumina particles was studied as a function of particle coating and relative air humidity. The nanocomposites were prepared from a mixture of EBA formulations (13 wt% butyl acrylate groups content) and alumina powder. The particles were either unmodified or surface-treated with aminopropyltriethoxy silane or octyltriethoxy silane. The filler content studied was 6 wt%. Every material formulation was thoroughly examined under SEM in order to verify homogeneous particle dispersion. Two different relative humidities of air were used for conditioning the samples prior to testing: 0 and 86 % RH.
The dielectric breakdown strength measurements were performed with a DC ramp of 1.2 kV/s. Ten samples were tested for each material formulation. Results were compared to the pristine EBA samples. Applying Weibull analysis to the measured data indicated a slight increase in breakdown strength for the dry nanocomposites filled with amino-treated particles as compared to the reference material in dry conditions. As expected, conditioning materials in humid environment had a negative impact on breakdown strength. This effect was more pronounced for nanocomposite materials, while the reference unfilled material was affected the least.
Place, publisher, year, edition, pages
IEEE , 2012. 323-326 p.
, Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, ISSN 0084-9162
Air humidity, Alumina particles, Alumina powder, Breakdown strengths, Butyl acrylates, Conditioning materials, Dielectric breakdown strength, Dry condition, Filler contents, Humid environment, Particle coatings, Particle dispersion, Reference material, Weibull analysis
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-104479DOI: 10.1109/CEIDP.2012.6378786ISI: 000316899800075ScopusID: 2-s2.0-84872081304ISBN: 978-1-4673-1252-3OAI: oai:DiVA.org:kth-104479DiVA: diva2:564914
2012 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2012; Montreal, QC;14 October 2012 through 17 October 2012
QC 201211142012-11-142012-11-052013-12-12Bibliographically approved