Wafer-Level Vacuum Sealing by Coining of Wire Bonded Gold Bumps
2013 (English)In: Journal of microelectromechanical systems, ISSN 1057-7157, E-ISSN 1941-0158, Vol. 22, no 6, 1347-1353 p.Article in journal (Refereed) Published
This paper reports on the investigation of a novel room-temperature vacuum sealing method based on compressing wire bonded gold bumps which are placed to partially overlap the access ports into the cavity. The bump compression, which is done under vacuum, causes a material flow into the access ports, thereby hermetically sealing a vacuum inside the cavities. The sealed cavity pressure was measured by residual gas analysis to 8x10(-4) mbar two weeks after sealing. The residual gas content was found to be mainly argon, which indicates the source as outgassing inside the cavity and no measurable external leak. The seals are found to be mechanically robust and easily implemented by the use of standard commercial tools and processes.
Place, publisher, year, edition, pages
2013. Vol. 22, no 6, 1347-1353 p.
Vacuum, packaging, MEMS, wire bonding, sealing, hermetic
Engineering and Technology
IdentifiersURN: urn:nbn:se:kth:diva-106203DOI: 10.1109/JMEMS.2013.2262594ISI: 000328047300012ScopusID: 2-s2.0-84897679362OAI: oai:DiVA.org:kth-106203DiVA: diva2:572971
FunderEU, European Research Council, 267528
QC 20140108. Updated from submitted to published.2012-11-292012-11-292014-01-08Bibliographically approved