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Temporary wafer bonding and debonding by an electrochemically active polymer adhesive for 3D integration
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0001-9552-4234
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
2013 (English)In: Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on, New York: IEEE , 2013, 381-384 p.Conference paper, Published paper (Refereed)
Abstract [en]

Thin wafer handling is an important issue in 3D integration technologies. This paper reports on an efficient method for bonding a thin wafer and debonding it at room temperature from a carrier wafer. This method addresses the major problem of fragility and flexibility in handling of thin wafers used in TSV fabrication. In the presented method the carrier wafer is spin coated with an electrochemically active polymer adhesive. It is then bonded to a device wafer. The wafer stack is thinned and finally released from the carrier wafer by applying a voltage.

Place, publisher, year, edition, pages
New York: IEEE , 2013. 381-384 p.
Series
Proceedings IEEE Micro Electro Mechanical Systems, ISSN 1084-6999
National Category
Nano Technology
Identifiers
URN: urn:nbn:se:kth:diva-108302DOI: 10.1109/MEMSYS.2013.6474258ISI: 000320549200098Scopus ID: 2-s2.0-84875412516ISBN: 978-1-4673-5654-1 (print)OAI: oai:DiVA.org:kth-108302DiVA: diva2:579880
Conference
IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013; Taipei; Taiwan; 20 January 2013 through 24 January 2013
Funder
EU, European Research Council, 267528
Note

QC 20130107

Available from: 2013-01-24 Created: 2012-12-20 Last updated: 2013-08-22Bibliographically approved

Open Access in DiVA

fulltext(1956 kB)2001 downloads
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Niklaus, FrankStemme, Göran

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