Semi-Serial On-Chip Link Implementation for Energy Efficiency and High Throughput
2012 (English)In: IEEE Transactions on Very Large Scale Integration (vlsi) Systems, ISSN 1063-8210, Vol. 20, no 12, 2265-2277 p.Article in journal (Refereed) Published
A high-throughput and low-energy semi-serial on-chip communication link based on novel design techniques and circuit solutions is presented. This self-timed link is designed using high-speed serialization/deserializtion and pulse dual-rail encoding techniques. The link also employs wave-pipelined differential pulse current-mode signaling to maintain the high speed data intake from the serializer. The energy efficiency of the proposed semi-serial link, which consists of bit-serial links in parallel, mainly comes from the sharing of the novel serializer's control circuit among the bit-serial links. In addition, the integration of pulse signaling with wave-pipelining, the use of a new low-complexity data validity detection technique, and the avoidance of data decoding logic also contribute to the power reduction. Furthermore, the formulated pulse dual-rail encoding provides an opportunity to implement pulse signaling at no cost. The ability to detect data validity at bit level allows acknowledgment per word without losing the delay-insensitivity of the transmission. The proposed semi-serial link is analyzed and compared with bit-serial and fully bit-parallel links for 64-bit data and communication distances of 1 to 8 mm. The semi-serial link which consists of eight bit-serial links provides 72.72 Gbps throughput with 286 fJ/bit energy dissipation for 8 mm transmission. It dissipates the lowest energy per bit compared to fully bit-parallel links while achieving the same throughput. The links are designed and simulated in Cadence Analog Spectre using 65-nm technology from STMicroelectronics.
Place, publisher, year, edition, pages
2012. Vol. 20, no 12, 2265-2277 p.
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-111507DOI: 10.1109/TVLSI.2011.2170228ISI: 000307443700010OAI: oai:DiVA.org:kth-111507DiVA: diva2:586762
QC 201301142013-01-122013-01-122013-01-14Bibliographically approved