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Dry adhesive bonding of nanoporous inorganic membranes to microfluidic devices using the OSTE(+) dual-cure polymer
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-9820-8728
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
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2013 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 23, no 2, 025021- p.Article in journal (Refereed) Published
Abstract [en]

We present two transfer bonding schemes for incorporating fragile nanoporous inorganic membranes into microdevices. Such membranes are finding increasing use in microfluidics, due to their precisely controllable nanostructure. Both schemes rely on a novel dual-cure dry adhesive bonding method, enabled by a new polymer formulation: OSTE(+), which can form bonds at room temperature. OSTE(+) is a novel dual-cure ternary monomer system containing epoxy. After the first cure, the OSTE(+) is soft and suitable for bonding, while during the second cure it stiffens and obtains a Young's modulus of 1.2 GPa. The ability of the epoxy to react with almost any dry surface provides a very versatile fabrication method. We demonstrate the transfer bonding of porous silicon and porous alumina membranes to polymeric microfluidic chips molded into OSTE(+), and of porous alumina membranes to microstructured silicon wafers, by using the OSTE(+) as a thin bonding layer. We discuss the OSTE(+) dual-cure mechanism, describe the device fabrication and evaluate the bond strength and membrane flow properties after bonding. The membranes bonded to OSTE(+) chips delaminate at 520 kPa, and the membranes bonded to silicon delaminate at 750 kPa, well above typical maximum pressures applied to microfluidic circuits. Furthermore, no change in the membrane flow resistance was observed after bonding.

Place, publisher, year, edition, pages
Institute of Physics Publishing (IOPP), 2013. Vol. 23, no 2, 025021- p.
Keyword [en]
Porous-Silicon, Mass-Spectrometry, Soft Lithography, DNA
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-116596DOI: 10.1088/0960-1317/23/2/025021ISI: 000313752800021Scopus ID: 2-s2.0-84877980868OAI: oai:DiVA.org:kth-116596DiVA: diva2:597478
Projects
Positive
Funder
EU, FP7, Seventh Framework Programme, 257401EU, European Research Council, 277879
Note

QC 20130125

Available from: 2013-01-25 Created: 2013-01-22 Last updated: 2017-12-06Bibliographically approved
In thesis
1. Heterogeneous material integration for MEMS
Open this publication in new window or tab >>Heterogeneous material integration for MEMS
2013 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

This thesis describes heterogeneous integration methods for the fabrication of microelectromechanical systems (MEMS). Most MEMS devices reuse the fabrication techniques that are found in the microelectronics integrated circuit industry. This limits the selection of materials and processes that are feasible for the realization of MEMS devices. Heterogeneous integration methods, on the other hand, consist of the separate pre-fabrication of sub-components followed by an assembly step. The pre-fabrication of subcomponents opens up for a wider selection of fabrication technologies and thus potentially better performing and more optimized devices. The first part of the thesis is focused upon an adhesive wafer-level layer transfer method to fabricate resistive microbolometer-based long-wavelength infrared focal plane arrays. This is realized by a CMOS-compatible transfer of monocrystalline silicon with epitaxially grown silicon-germanium quantum wells. Heterogeneous transfer methods are also used for the realization of filtering devices, integration of distributed small dies onto larger wafer formats and to fabricate a graphene-based pressure sensor. The filtering devices consist of very fragile nano-porous membranes that with the presented dry adhesive methods can be transferred without clogging or breaking. Pick-and-place methods for the massive transfer of small dies between different wafer formats are limited by time and die size-considerations. Our presented solution solves these problems by expanding a die array on a flexible tape, followed by adhesive wafer bonding to a target wafer. Furthermore, a gauge pressure sensor is realized by transferring a graphene monolayer grown on a copper foil to a micromachined target wafer with a silicon oxide interface layer. This device is used to extract the gauge factor of graphene. Adhesive bonding is an enabling technology for the presented heterogeneous integration techniques. A blister test method together with an experimental setup to characterize the bond energies between adhesives and bonded substrates is also presented.

Place, publisher, year, edition, pages
Stockholm: KTH Royal Institute of Technology, 2013. xii, 87 p.
Series
Trita-EE, ISSN 1653-5146 ; 2013:039
National Category
Engineering and Technology
Identifiers
urn:nbn:se:kth:diva-129185 (URN)
Public defence
2013-10-25, Kollegiesalen, Brinellvägen 8, KTH, Stockholm, 10:00 (English)
Opponent
Supervisors
Note

QC 20131003

Available from: 2013-10-03 Created: 2013-09-22 Last updated: 2013-10-04Bibliographically approved

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Forsberg, FredrikNiklaus, FrankHaraldsson, TommyWijngaart, Wouter van derGylfason, Kristinn B.

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