True planar InAs/AlSb HEMTs with ion-implantation technique for low-power cryogenic applications
2013 (English)In: Solid-State Electronics, ISSN 0038-1101, E-ISSN 1879-2405, Vol. 79, 268-273 p.Article in journal (Refereed) Published
In this paper, we report the room-temperature and cryogenic properties of true planar 110 nm InAs/AlSb HEMTs fabricated with Ar-ion isolation technology. Device isolation is generally improved and is in particular increased by four orders of magnitude at 6 K compared to 300 K. This results in improved drain current saturation, lower gate leakage current and 23% higher peak transconductance. The RF performance is significantly improved as well, with 47% higher fT (162 GHz) and 72% higher fmax (155 GHz) at the low drain voltage of 0.1 V, compared to room temperature. The overall performance of the fabricated devices shows the suitability of ion implantation for the device isolation at cryogenic temperature. Furthermore, the excellent stability against oxidation and truly planar structure of these devices demonstrate great potential for highly integrated cryogenic millimeter-wave circuits in InAs/AlSb technology with ultra-low power consumption.
Place, publisher, year, edition, pages
2013. Vol. 79, 268-273 p.
Cryogenic, InAs/AlSb high electron mobility transistor (HEMT), Ion implantation, Low-power, MMICs
Engineering and Technology
IdentifiersURN: urn:nbn:se:kth:diva-117786DOI: 10.1016/j.sse.2012.06.013ISI: 000313611000051ScopusID: 2-s2.0-84869493437OAI: oai:DiVA.org:kth-117786DiVA: diva2:603100
QC 201302052013-02-052013-02-052013-02-21Bibliographically approved