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HETEROGENEOUS INTEGRATION METHOD FOR TRANSFER OFEXPANDED DIE MATRICES TO LARGE FORMAT WAFERS USINGAN EXPANDABLE TAPE
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2012 (English)Conference paper, Poster (with or without abstract) (Other academic)
Abstract [en]

This paper reports on the realization of a novel method for batch transfer of multiple separate dies from a smallersubstrate onto a larger wafer substrate by using a standard matrix expander in combination with adhesive waferbonding and an elastic dice tape. We demonstrate the expansion and transfer of about 30000 chips from a 100mm wafer to a 200 mm wafer with a 22 μm standard deviation of positioning accuracy.

Place, publisher, year, edition, pages
2012.
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-117980OAI: oai:DiVA.org:kth-117980DiVA: diva2:604100
Conference
MSW 2012 Linköping
Note

QC 20130521

Available from: 2013-02-07 Created: 2013-02-07 Last updated: 2013-05-21Bibliographically approved

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Forsberg, FredrikHaraldsson, TommyStemme, GöranNiklaus, Frank

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Forsberg, FredrikRoxhed, NiclasHaraldsson, TommyStemme, GöranNiklaus, Frank
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CiteExportLink to record
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