HETEROGENEOUS INTEGRATION METHOD FOR TRANSFER OFEXPANDED DIE MATRICES TO LARGE FORMAT WAFERS USINGAN EXPANDABLE TAPE
2012 (English)Conference paper, Poster (Other academic)
This paper reports on the realization of a novel method for batch transfer of multiple separate dies from a smallersubstrate onto a larger wafer substrate by using a standard matrix expander in combination with adhesive waferbonding and an elastic dice tape. We demonstrate the expansion and transfer of about 30000 chips from a 100mm wafer to a 200 mm wafer with a 22 μm standard deviation of positioning accuracy.
Place, publisher, year, edition, pages
Engineering and Technology
IdentifiersURN: urn:nbn:se:kth:diva-117980OAI: oai:DiVA.org:kth-117980DiVA: diva2:604100
MSW 2012 Linköping
QC 201305212013-02-072013-02-072013-05-21Bibliographically approved