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Unconventional applications of wire bonding create opportunities for microsystem integration
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0003-3452-6361
University of Freiburg, Freiburg, Germany . (Department of Microsystems Engineering—IMTEK)
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0001-9552-4234
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2013 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 23, no 8, 083001- p.Article, review/survey (Refereed) Published
Abstract [en]

Automatic wire bonding is a highly mature, cost-efficient and broadly available back-endprocess, intended to create electrical interconnections in semiconductor chip packaging. Modern production wire-bonding tools can bond wires with speeds of up to 30 bonds per second with placement accuracies of better than 2 mu m, and the ability to form each wire individually into a desired shape. These features render wire bonding a versatile tool also for integrating wires in applications other than electrical interconnections. Wire bonding has been adapted and used to implement a variety of innovative microstructures. This paper reviews unconventional uses and applications of wire bonding that have been reported in the literature. The used wire-bonding techniques and materials are discussed, and the implemented applications are presented. They include the realization and integration of coils, transformers, inductors, antennas, electrodes, through silicon vias, plugs, liquid and vacuum seals, plastic fibers, shape memory alloy actuators, energy harvesters and sensors.

Place, publisher, year, edition, pages
IOP publishing , 2013. Vol. 23, no 8, 083001- p.
Keyword [en]
Electrical interconnections, Energy Harvester, Placement accuracy, Plastic fibers, Semiconductor chips, Shape memory alloy actuators, Through silicon vias, Versatile tools
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-124074DOI: 10.1088/0960-1317/23/8/083001ISI: 000322221100001Scopus ID: 2-s2.0-84881141946OAI: oai:DiVA.org:kth-124074DiVA: diva2:632576
Funder
EU, European Research Council, 267528 277879
Note

QC 20130709

Available from: 2013-06-25 Created: 2013-06-25 Last updated: 2017-12-06Bibliographically approved

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Fischer, Andreas C.Stemme, GöranNiklaus, Frank

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