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Thermal and rheological properties of micro- and nanofluids of copper: designed as heat exchange fluid
KTH, School of Information and Communication Technology (ICT), Materials- and Nano Physics, Functional Materials, FNM.ORCID iD: 0000-0003-1815-1053
2013 (English)Conference paper, Poster (Other academic)
Place, publisher, year, edition, pages
Keyword [en]
Copper, Nanofluid, Thermal Conductivity, Viscosity
National Category
Nano Technology
URN: urn:nbn:se:kth:diva-124190OAI: diva2:633650
MRS, San Francisco, USA, April 1-5, 2013

QC 20140225

Available from: 2013-06-27 Created: 2013-06-27 Last updated: 2014-02-25Bibliographically approved

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Nikkam, Nader
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