Thermal evaluation of a liquid/air cooled integrated power inverter for hybrid vehicle applications
2013 (English)In: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013, New York: IEEE , 2013, 6529944- p.Conference paper (Refereed)
A thermal design of an integrated double-side cooled SiC 50kW-1200V-200A power inverter for hybrid electric vehicle applications has been proposed to enable cooling in two different automotive operating environments: under-hood and controlled temperature environment of passenger compartment. The power inverter is integrated with air/liquid cooled cold plates equipped with finned channels. Concept evaluation and CFD model calibration have been performed on a simplified thermal prototype. Computational experiments on the detailed model of the inverter, including packaging materials, have been performed for automotive industry defined application scenarios, including two extreme and one typical driving cycles. For the studied application scenarios the case temperature of the SiC transistors and diodes have been found to be below 210°C. The maximum steady-state temperature of the DC-link capacitor has been below 127 °C for the worst-case scenario including liquid cooling, and up to 140 °C for the worst-case scenario with air-cooling.
Place, publisher, year, edition, pages
New York: IEEE , 2013. 6529944- p.
Application scenario, Computational experiment, Controlled temperature, Operating environment, Passenger compartment, Steady-state temperature, Thermal evaluations, Vehicle applications
Electrical Engineering, Electronic Engineering, Information Engineering
Research subject SRA - Energy
IdentifiersURN: urn:nbn:se:kth:diva-127046DOI: 10.1109/EuroSimE.2013.6529944ISI: 000326869600055ScopusID: 2-s2.0-84880987018ISBN: 978-146736138-5OAI: oai:DiVA.org:kth-127046DiVA: diva2:643657
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013; Wroclaw; Poland; 14 April 2013 through 17 April 2013
QC 201401272013-08-282013-08-282014-01-27Bibliographically approved