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Pressure dependence of thermal contact resistance between copper heat sink and copper DBC surfaces in SiC power device packages
KTH, School of Electrical Engineering (EES), Electrical Energy Conversion.ORCID iD: 0000-0002-1755-1365
2014 (English)In: Silicon Carbide and Related Materials 2013, Trans Tech Publications Inc., 2014, 1118-1121 p.Conference paper (Refereed)
Abstract [en]

Thermal contact resistances have been measured in an experiment emulating heat transfer from a SiC die to a cooled heat sink through a heat spreader and a DBC structure. The major surface-dependent parameters are the surface roughness, surface hardness, and planarity. The measured thermal contact resistances are in agreement with theoretical values. When investigating DBC copper surfaces a second interface between the bonded Cu to AlN has to be taken into account.

Place, publisher, year, edition, pages
Trans Tech Publications Inc., 2014. 1118-1121 p.
, Materials Science Forum, ISSN 0255-5476 ; 778-780
Keyword [en]
Cooling, DBC, Heat transfer, Packaging, Planarity, Pressure dependence, SiC, Surface parameter, Surface roughness, Thermal contact resistance
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
SRA - Energy
URN: urn:nbn:se:kth:diva-133317DOI: 10.4028/ 000348066300257ScopusID: 2-s2.0-84896064403ISBN: 978-3-03835-010-1OAI: diva2:660510
15th International Conference on Silicon Carbide and Related Materials, ICSCRM 2013, Miyazaki, Japan, 29 September 2013 through 4 October 2013

QC 20150220

Available from: 2013-10-30 Created: 2013-10-30 Last updated: 2015-02-20Bibliographically approved

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Nee, Hans-Peter
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ReferencesLink to record
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