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Dual-function gate driver for a power module with SiC junction field transistors
KTH, School of Electrical Engineering (EES), Electrical Energy Conversion.ORCID iD: 0000-0001-6184-6470
KTH, School of Electrical Engineering (EES), Electrical Energy Conversion.
KTH, School of Electrical Engineering (EES), Electrical Energy Conversion.
KTH, School of Electrical Engineering (EES), Electrical Energy Conversion.ORCID iD: 0000-0002-1755-1365
2013 (English)In: 2013 IEEE ECCE Asia Downunder - 5th IEEE Annual International Energy Conversion Congress and Exhibition, IEEE ECCE Asia 2013, IEEE , 2013, 245-250 p.Conference paper, Published paper (Refereed)
Abstract [en]

Driving a high-power module which is populated with several parallel-connected silicon carbide junction field-effect transistor chips must be done appropriately. Parasitic elements may give rise to oscillations during turn-on and turn-off. Fast and oscillation-free switching performance is desired in order to achieve a high efficiency. The key-issue in order to fulfill these two requirements is the design of a sophisticated gate driver. This paper proposes a dual-function gate-drive unit which is able to switch the module with an acceptable speed without letting the current and voltage suffer from significant oscillations. It is experimentally shown that turn-on and turn-off switching times of approximately 140 ns and 165 ns respectively can be reached, while the magnitude of the current oscillations is kept at an acceptable level. Moreover, using the proposed gate driver an efficiency of approximately 99.6% is expected for a three-phase converter rated at 125 kVA and having a switching frequency of 2 kHz.

Place, publisher, year, edition, pages
IEEE , 2013. 245-250 p.
Keyword [en]
Gate Driver, Junction Field Effect Transistor, Power Module, Silicone Carbide
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
SRA - Energy
Identifiers
URN: urn:nbn:se:kth:diva-133369DOI: 10.1109/ECCE-Asia.2013.6579104ISI: 000332789100040Scopus ID: 2-s2.0-84883717322ISBN: 978-147990482-2 (print)OAI: oai:DiVA.org:kth-133369DiVA: diva2:661951
Conference
2013 IEEE ECCE Asia Downunder - 5th IEEE Annual International Energy Conversion Congress and Exhibition, IEEE ECCE Asia 2013; Melbourne, VIC; Australia; 3 June 2013 through 6 June 2013
Funder
StandUp
Note

QC 20131105

Available from: 2013-11-05 Created: 2013-10-31 Last updated: 2016-09-16Bibliographically approved
In thesis
1. Extreme Implementations of Wide-Bandgap Semiconductors in Power Electronics
Open this publication in new window or tab >>Extreme Implementations of Wide-Bandgap Semiconductors in Power Electronics
2016 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

Wide-bandgap (WBG) semiconductor materials such as silicon carbide (SiC) and gallium-nitride (GaN) allow higher voltage ratings, lower on-state voltage drops, higher switching frequencies, and higher maximum temperatures. All these advantages make them an attractive choice when high-power density and high-efficiency converters are targeted. Two different gate-driver designs for SiC power devices are presented. First, a dual-function gate-driver for a power module populated with SiC junction field-effect transistors that finds a trade-off between fast switching speeds and a low oscillative performance has been presented and experimentally verified. Second, a gate-driver for SiC metal-oxide semiconductor field-effect transistors with a short-circuit protection scheme that is able to protect the converter against short-circuit conditions without compromising the switching performance during normal operation is presented and experimentally validated. The benefits and issues of using parallel-connection as the design strategy for high-efficiency and high-power converters have been presented. In order to evaluate parallel connection, a 312 kVA three-phase SiC inverter with an efficiency of 99.3 % has been designed, built, and experimentally verified. If parallel connection is chosen as design direction, an undesired trade-off between reliability and efficiency is introduced. A reliability analysis has been performed, which has shown that the gate-source voltage stress determines the reliability of the entire system. Decreasing the positive gate-source voltage could increase the reliability without significantly affecting the efficiency. If high-temperature applications are considered, relatively little attention has been paid to passive components for harsh environments. This thesis also addresses high-temperature operation. The high-temperature performance of two different designs of inductors have been tested up to 600_C. Finally, a GaN power field-effect transistor was characterized down to cryogenic temperatures. An 85 % reduction of the on-state resistance was measured at −195_C. Finally, an experimental evaluation of a 1 kW singlephase inverter at low temperatures was performed. A 33 % reduction in losses compared to room temperature was achieved at rated power.

Place, publisher, year, edition, pages
Stockholm: KTH Royal Institute of Technology, 2016. 101 p.
Series
TRITA-EE, ISSN 1653-5146 ; 2016:145
Keyword
Cryogenic, Gallium Nitride, Gate Driver, Harsh Environments, High Efficiency Converter, High Temperature, MOSFETs, Normally- ON JFETs, Reliability, Silicon Carbide, Wide-Band Gap Semiconductors
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Research subject
Electrical Engineering
Identifiers
urn:nbn:se:kth:diva-192626 (URN)978-91-7729-109-1 (ISBN)
Public defence
2016-10-14, Kollegiesalen, Brinellvägen 8, KTH-huset, KTH, Stockholm, 09:53 (English)
Opponent
Supervisors
Note

QC 20160922

Available from: 2016-09-22 Created: 2016-09-16 Last updated: 2016-09-22Bibliographically approved

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Colmenares, JuanNee, Hans-Peter

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