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Dry adhesive bonding of porous alumina membranes to microstructured silicon wafers using the OSTE(+) dual-cure polymer
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-9820-8728
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-0441-6893
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2013 (English)In: Proceedings of the International Conference on Wafer Bonding / [ed] Roy Knechtel, 2013, -150 p.Conference paper, Poster (with or without abstract) (Other academic)
Place, publisher, year, edition, pages
2013. -150 p.
Keyword [en]
Adhesive wafer bonding, porous alumina, OSTE+
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-133610OAI: oai:DiVA.org:kth-133610DiVA: diva2:662550
Conference
Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Stockholm, December 5th and 6th, 2013
Projects
Positive, M&M
Funder
EU, European Research CouncilEU, FP7, Seventh Framework Programme
Note

NQC 2014

Available from: 2013-11-07 Created: 2013-11-07 Last updated: 2014-05-09Bibliographically approved

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Authority records BETA

Forsberg, FredrikNiklaus, FrankHaraldsson, TommyWijngaart, Wouter van derGylfason, Kristinn B.

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