Silicon platform-based nanophotonics for interconnect applications
2013 (English)Conference paper, Abstract (Refereed)
In this paper we present our technology based on silicon platform used for fabrication of nanophotonic devices as well as novel components with hybrid plasmonic nanowire waveguides. Over past decade silicon photonics established its position as an important photonic platform, mainly due to compatibility to microelectronic fabrication and great advantage of CMOS process compatibility allowing for high accuracy, high yield and possibility for mass production. This technology is intended to drive optical interconnect applications that demand high-volume and low-cost production of a wide scale of interconnect components and structures for data communication from data centers to intra-core architectures. We have designed and fabricated a variety of passive devices based on Si nanowire waveguides allowing to build highly integrated structures. For the inter- and intra-core communication the size of these structures is constrained by the diffraction limit of light. To go below this limit, plasmonic structures based on metal-dielectric interfaces have been proposed although their intrinsic high losses make their use with the available metal films impractical. Recently a new type of "hybrid plasmonic waveguides" was developed that allows for similar light confinement as in a metal-insulator-metal structure, but with much longer propagation lengths. Here a very thin low-index dielectric layer (slot layer) is sandwiched between a metal from one side and a high-index dielectric from the other side. Using this structure a number of different components based on hybrid plasmonic waveguides have been simulated and/or fabricated including waveguide couplers and splitters, different ring and disk resonators, polarisation beam splitters etc. This provides the way to realize subwavelength functional components for future ultra-compact integrated structures for optical interconnects and other applications.
Place, publisher, year, edition, pages
2013. 758-759 p.
, PIERS PROCEEDINGS 2013, Progress In Electromagnetics Research Symp, ISSN ISSN 1559-9450
Nanophotonics, Si-based photonics, Photonic integrated circuits, Interconnects
Engineering and Technology
Research subject SRA - ICT
IdentifiersURN: urn:nbn:se:kth:diva-136704OAI: oai:DiVA.org:kth-136704DiVA: diva2:676725
Progress In Electromagnetics Research Symposium 2013, SC3: Integrated Nanophotonics for Optical Interconnects in Data Centers, Stockholm, Sweden, August 12–15, 2013
ProjectsPhotonic Integrated Circuits
FunderSwedish Research Council, VR-621-2010-4379
QC 201408262013-12-062013-12-062014-08-26Bibliographically approved