Adhesive Wafer Bonding, Applications and Trends
2010 (English)In: Semiconductor Wafer Bonding 11: Science, Technology, And Applications - In Honor Of Ulrich Gosele, Electrochemical Society, 2010, no 4, 273-286 p.Conference paper (Refereed)
Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronics, micro- and nano-electromechanical systems (MEMS / NEMS) and packaging applications. The main advantages of adhesive wafer bonding include the insensitivity to surface topography, the low bonding temperatures (between room temperature and 450 degrees C, depending on the polymer adhesive), the compatibility with standard CMOS integrated circuit wafers and the ability to join different types of materials. While adhesive wafer bonding is a comparably simple, robust and low-cost process, concerns need to be considered such as the permeability of polymers for gasses and moisture, limited temperature stability and limited data about long-term stability of many polymers in demanding environments. This paper reviews the state-of-the-art of adhesive wafer bonding technologies, applications and future trends.
Place, publisher, year, edition, pages
Electrochemical Society, 2010. no 4, 273-286 p.
, ECS Transactions, ISSN 1938-5862 ; 33
Adhesive wafer bonding, Bonding temperatures, Fabrication technique, Future trends, Limited data, Long term stability, Nano electromechanical systems, Packaging applications, Polymer adhesives, Room temperature, Temperature stability
Engineering and Technology
IdentifiersURN: urn:nbn:se:kth:diva-138110DOI: 10.1149/1.3483517ISI: 000313616900029ScopusID: 2-s2.0-79952665794ISBN: 978-1-60768-173-1OAI: oai:DiVA.org:kth-138110DiVA: diva2:680470
Symposium on Semiconductor Wafer Bonding 11 - Science, Technology, and Applications - In Honor of Ulrich Gosele Held During the 218th Meeting of the Electrochemical-Society (ECS), OCT 10-15, 2010, Las Vegas, NV
QC 201312182013-12-182013-12-182013-12-18Bibliographically approved