A scalable multi-dimensional NoC simulation model for diverse spatio-temporal traffic patterns
2013 (English)In: 2013 IEEE International 3D Systems Integration Conference, 3DIC 2013, IEEE , 2013, 6702365- p.Conference paper (Refereed)
This paper describes a powerful simulation platform that enables accurate simulations of numerous network configurations under realistic traffic patterns to predict the performance and power needs of a 3-D integrated system early in the design flow. The simulation platform can model virtually any sized 2-D or 3-D network configuration, providing low-cost and fast tradeoff evaluations of various systems architectures. The network simulator uses scalable RTL-level models that can be used for accurate power and timing analyses. We demonstrate the capability of our simulation model by analyzing the performance of various network topologies under spatio-temporal traffic patterns to show how the network topology can be adjusted to meet the performance requirements of a design before it is manufactured. The simulation results can be used to optimize the placement of cores and communication buses early in the flow. By using the model, standard applications such as mobile application processor, femto-cell base-stations on-chip and wide-IO TSV memory stacking can be simulated.
Place, publisher, year, edition, pages
IEEE , 2013. 6702365- p.
, IEEE International 3D Systems Integration Conference, ISSN 2164-0157
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-143176DOI: 10.1109/3DIC.2013.6702365ISI: 000333258200052ScopusID: 2-s2.0-84893929548ISBN: 978-146736484-3OAI: oai:DiVA.org:kth-143176DiVA: diva2:705673
2013 IEEE International 3D Systems Integration Conference, 3DIC 2013; San Francisco, CA; United States; 2 October 2013 through 4 October 2013
QC 201403172014-03-172014-03-172015-12-21Bibliographically approved