Through-Silicon Vias and 3D Inductors for RF Applications
2014 (English)In: Microwave journal (International ed.), ISSN 0192-6225, Vol. 57, no 2, 80- p.Article in journal (Refereed) Published
To cope with an increasing number of frequency bands and advanced mobile phone standards supporting high data rates, current and future wireless communication systems must satisfy stringent performance expectations while simultaneously being more energy-efficient and having lower operating costs. One major limitation of today's mobile phones is poor impedance matching of the antenna to the RF front end section resulting in poor antenna efficiency. This is exacerbated by current trends toward higher miniaturization and integration, presenting ever increasing challenges in the design of complex RF systems and the management of RF interaction on signal lines. By introducing tunable RF elements, the overall system architecture can be simplified, leading to significant cost reductions and performance optimization.
Place, publisher, year, edition, pages
2014. Vol. 57, no 2, 80- p.
Telecommunications Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-143997ISI: 000332058700016ScopusID: 2-s2.0-84896780246OAI: oai:DiVA.org:kth-143997DiVA: diva2:710067
QC 201404042014-04-042014-04-042014-04-04Bibliographically approved