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Evaluation of non-contact flexible electrodes connected with a customized IC-steps towards a fully integrated ECG sensor
KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.ORCID iD: 0000-0002-0528-9371
KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.
2013 (English)In: NORCHIP, 2013, IEEE , 2013, 6702023- p.Conference paper, Published paper (Refereed)
Abstract [en]

This study investigates the performance of a noncontact capacitive bioelectric sensor for electrocardiogram (ECG) measurement. A straightforward comparison is made on the measured ECG signals using conventional pre-gelled electrodes and the developed non-contact electrodes on a hairy chest, with the same bio-sensing readout circuits. The measurement results show that pre-gelled electrodes have difficulties in the measurement of ECG signal from a hairy chest. A pair of non-contact electrodes are designed and implemented on flexible copper foil. With the help of high performance readout circuits, ECG signal is successfully measured via implemented non-contact electrodes from a hairy chest. Discussions are made based on the preliminary in-vivo measurement results. It is believed that this non-contact ECG measurement approach brings a promising solution for the future fully integrated wearable ECG sensors.

Place, publisher, year, edition, pages
IEEE , 2013. 6702023- p.
Keyword [en]
ECG monitoring, ECG sensors, non-contact electrode, SoC, wearable devices
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-143818DOI: 10.1109/NORCHIP.2013.6702023ISI: 000345902700027Scopus ID: 2-s2.0-84893602825ISBN: 978-1-4799-1647-4 (print)OAI: oai:DiVA.org:kth-143818DiVA: diva2:712330
Conference
NORCHIP 2013; Vilnius; Lithuania; 11 November 2013 through 12 November 2013
Funder
VINNOVA
Note

QC 20140414

Available from: 2014-04-14 Created: 2014-03-31 Last updated: 2016-04-04Bibliographically approved

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Xie, Li

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