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Polymer Adhesive Wafer Bonding
KTH, School of Electrical Engineering (EES), Microsystem Technology (Changed name 20121201).ORCID iD: 0000-0002-0525-8647
2012 (English)In: Handbook of Wafer Bonding, Wiley-VCH Verlagsgesellschaft, 2012, 33-61 p.Chapter in book (Refereed)
Place, publisher, year, edition, pages
Wiley-VCH Verlagsgesellschaft, 2012. 33-61 p.
Keyword [en]
Adhesive wafer bonding, BCB, Elastomer, Epoxy, Intermediate layer bonding, Localized wafer bonding, Polymer wafer bonding, Temporary handle wafer bonding, Thermoplastic polymer, Thermosetting polymer
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-144834DOI: 10.1002/9783527644223.ch3Scopus ID: 2-s2.0-84885752675ISBN: 978-352732646-4 OAI: oai:DiVA.org:kth-144834DiVA: diva2:714677
Note

QC 20140429

Available from: 2014-04-29 Created: 2014-04-29 Last updated: 2014-04-29Bibliographically approved

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Niklaus, Frank

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