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Dry adhesive bonding of porous membranes to microstructured silicon wafers using the OSTE(+) dual-cure polymer
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-9820-8728
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-0441-6893
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2014 (English)In: Proceedings of the 10th Micronano System Workshop (MSW 2014), 2014Conference paper, Poster (with or without abstract) (Other academic)
Place, publisher, year, edition, pages
2014.
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-145124OAI: oai:DiVA.org:kth-145124DiVA: diva2:716429
Conference
Micronano System Workshop (MSW 2014), Uppsala, May 15-16, 2014.
Projects
PositiveM&M
Funder
EU, FP7, Seventh Framework Programme, 257401EU, European Research Council, 277879
Note

NQC 2015

Available from: 2014-05-09 Created: 2014-05-09 Last updated: 2015-02-19Bibliographically approved

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Authority records BETA

Forsberg, FredrikNiklaus, FrankHaraldsson, TommyWijngaart, Wouter van derGylfason, Kristinn B.

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Saharil, FarizahForsberg, FredrikNiklaus, FrankHaraldsson, TommyWijngaart, Wouter van derGylfason, Kristinn B.
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