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Temporary Wafer Bonding and Debonding for 3D Integration Using an Electrochemically Active Polymer Adhesive
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-8853-0967
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-0525-8647
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
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2014 (English)In: ECS Journal of Solid State Science and Technology, ISSN 2162-8769, Vol. 3, no 5, P115-P121 p.Article in journal (Refereed) Published
Abstract [en]

The use of thin silicon wafers is an enabling technology for 3D integration in the semiconductor industry. However, thin silicon wafers are fragile to handle and reliable solutions are required for thin wafer handling. This paper reports a novel method of bonding and debonding a thin wafer (< 50 mu m) using an electrochemically active polymer adhesive. In the presented method the carrier wafer is first spin coated with the adhesive and then bonded to the device wafer by applying force and temperature. Debonding of the wafer is realized at room temperature by applying a voltage between the carrier and the device wafer, which substantially reduces the bond strength. The bonding and debonding properties of the adhesive show that temporary wafer bonding using electrochemically active adhesives has the potential to be an attractive approach for temporary wafer bonding for thin wafer handling in 3D integration processes.

Place, publisher, year, edition, pages
2014. Vol. 3, no 5, P115-P121 p.
Keyword [en]
Electrelease
National Category
Engineering and Technology
Identifiers
URN: urn:nbn:se:kth:diva-145289DOI: 10.1149/2.001405jssISI: 000334161400006Scopus ID: 2-s2.0-84904717006OAI: oai:DiVA.org:kth-145289DiVA: diva2:717376
Note

QC 20140515

Available from: 2014-05-15 Created: 2014-05-15 Last updated: 2015-09-07Bibliographically approved
In thesis
1. MEMS-based electrochemical gas sensors and wafer-level methods
Open this publication in new window or tab >>MEMS-based electrochemical gas sensors and wafer-level methods
2015 (English)Doctoral thesis, comprehensive summary (Other academic)
Abstract [en]

This thesis describes novel microel ectromechanical system (MEMS) based electrochemical gas sensors and methods of fabrication.

This thesis presents the research in two parts. In the first part, a method to handle a thin silicon wafer using an electrochemically active adhesive is described. Handling of a thin silicon wafer is an important issue in 3D-IC manufacturing where through silicon vias (TSVs) is an enabling technology. Thin silicon wafers are flexible and fragile, therefore difficult to handle. In addressing the need for a reliable solution, a method based on an electrochemically active adhesive was developed. In this method, an electrochemically active adhesive was diluted and spin coated on a 100 mm diameter silicon wafer (carrier wafer) on which another silicon wafer (device wafer) was bonded. Device wafer was subjected to post processing fabrication technique such as wafer thinning. Successful debonding of the device wafer was achieved by applying a voltage between the two wafers. In another part of the research, a fabrication process for developing a functional nanoporous material using atomic layer deposition is presented. In order to realize a nanoporous electrode, a nanoporous anodized aluminum oxide (AAO) substrate was used, which was functionalized with very thin layers (~ 10 nm) of platinum (Pt) and aluminum oxide (Al2O3) using atomic layer deposition. Nanoporous material when used as an electrode delivers high sensitivity due to the inherent high surface area and is potentially applicable in fuel cells and in electrochemical sensing.

The second part of the thesis addresses the need for a high performance gas sensor that is applicable for asthma monitoring. Asthma is a disease related to the inflammation in the airways of the lungs and is characterized by the presence of nitric oxide gas in the exhaled breath. The gas concentration of above approximately 50 parts-per-billion indicates a likely presence of asthma. A MEMS based electrochemical gas sensor was successfully designed and developed to meet the stringent requirements needed for asthma detection. Furthermore, to enable a hand held asthma measuring instrument, a miniaturized sensor with integrated electrodes and liquid electrolyte was developed. The electrodes were assembled at a wafer-level to demonstrate the feasibility towards a high volume fabrication of the gas sensors. In addition, the designed amperometric gas sensor was successfully tested for hydrogen sulphide concentration, which is a bio marker for bad breath.

Place, publisher, year, edition, pages
Stockholm: KTH Royal Institute of Technology, 2015. xiv, 77 p.
Series
TRITA-EE, ISSN 1653-5146 ; 2015:030
Keyword
MEMS, gas sensors, electrochemical, nitric oxide, hydrogen sulphide, nafion, nano
National Category
Engineering and Technology
Identifiers
urn:nbn:se:kth:diva-172955 (URN)978-91-7595-661-9 (ISBN)
Public defence
2015-10-02, Q2, Osquldas väg 10,, Stockholm, 10:00 (English)
Opponent
Supervisors
Funder
EU, European Research Council, 267528VINNOVASwedish Research Council
Note

QC 20150907

Available from: 2015-09-07 Created: 2015-09-03 Last updated: 2015-09-07Bibliographically approved

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Schröder, StephanNiklaus, FrankStemme, Göran

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