Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Metal Filling of Through Silicon Vias (TSVs) using Wire Bonding Technology
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.
2014 (English)Independent thesis Advanced level (professional degree), 20 credits / 30 HE creditsStudent thesis
Abstract [en]

Through Silicon Vias (TSVs) are vertical interconnections providing the shortest possible signal paths between vertically stacked chips in 3D packaging. In this thesis, TSVs are fabricated and two novel approaches for the metal filling of TSVs are investigated. A wire bonder is utilized to apply TSV core material in the form of gold stud bumps. The metal filling approaches are carried out by 1) squeezing stud bumps down the TSV holes by utilizing a wafer bonder and 2) stacking stud bumps on the outer periphery of the TSV holes and thereby forcing the material further down. Both approaches have successfully filled TSV holes of varying depths and no voids have been observed. The squeezing approach reaches measured depths of up to 52.9 μm and the stacking approach reaches depths of up to 100 μm.

Place, publisher, year, edition, pages
2014.
Series
EES Examensarbete / Master Thesis
Keyword [en]
Through Silicon Vias, TSV, wire bonding
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-145552OAI: oai:DiVA.org:kth-145552DiVA: diva2:718812
Educational program
Master of Science in Engineering - Microelectronics
Supervisors
Examiners
Available from: 2014-07-14 Created: 2014-05-22 Last updated: 2014-07-14Bibliographically approved

Open Access in DiVA

mfotsvuwbt(2467 kB)319 downloads
File information
File name FULLTEXT01.pdfFile size 2467 kBChecksum SHA-512
f8e8d8356d9ab78edd1656e4f1627ef31f870fa53459ec3e2f646470f5e86202f2e195328a949040fb8b2a230b1715d0a2d38854d1a27a9efdc163098dd7073f
Type fulltextMimetype application/pdf

By organisation
Micro and Nanosystems
Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar
Total: 319 downloads
The number of downloads is the sum of all downloads of full texts. It may include eg previous versions that are now no longer available

urn-nbn

Altmetric score

urn-nbn
Total: 223 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf