Integrating 3D PIN germanium detectors with high-k ALD fabricated slot waveguides
2014 (English)In: ULIS 2014 - 2014 15th International Conference on Ultimate Integration on Silicon, IEEE Computer Society, 2014, 45-48 p.Conference paper (Refereed)
A novel device technology for photonics integrated circuits (PICs) is presented. In this work germanium PIN photodetectors are embedded in back-end deposited high-k slot waveguides. The waveguides are fabricated using chemical vapor deposited amorphous silicon and atomic layer deposition of Al 2O3 thin films. The germanium PIN stack is selectively grown on a bulk silicon substrate. The detectors are butt coupled to the slot waveguides. Using our selective germanium growth and interconnect technology we study a 3D multilayer photonic integration for CMOS back-end of the line (BEOL) process. Finally we demonstrate the fabrication of a photonic chip deploying this technology platform.
Place, publisher, year, edition, pages
IEEE Computer Society, 2014. 45-48 p.
CMOS technology, germanium photodetectors, optical interconnects, photonics integrated circuits(PIC), silicon photonics, slot waveguides
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-146703DOI: 10.1109/ULIS.2014.6813902ISI: 000341731300012ScopusID: 2-s2.0-84901355177OAI: oai:DiVA.org:kth-146703DiVA: diva2:724782
2014 15th International Conference on Ultimate Integration on Silicon, ULIS 2014; Stockholm; Sweden; 7 April 2014 through 9 April 2014
QC 201406132014-06-132014-06-132014-11-14Bibliographically approved