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SoP design on liquid crystal polymer substrate for 5 GHz RF receiver front-end module
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT. Computer Engineering Department, University of Engineering and Technology Taxila, Pakistan .
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.
2005 (English)In: International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System, 2005, 236-240 p.Conference paper, Published paper (Refereed)
Abstract [en]

Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. This paper presents highdensity multilayer interconnects and integrated passives used to design high performance prototype filter for 5GHz wireless LAN receiver realized on liquid crystal polymer (LCP) substrate. The thin film implementation of Multichip Module technology is identified as a useful platform for the integration of GaAs MMIC and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performance in the microwave frequency regime has now been demonstrated.

Place, publisher, year, edition, pages
2005. 236-240 p.
Keyword [en]
Bandpass filter, Liquid crystal polymer, Low noise amplifier, Quality factor, RF front-end
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-148550Scopus ID: 2-s2.0-84878228599ISBN: 978-160423572-2 (print)OAI: oai:DiVA.org:kth-148550DiVA: diva2:737403
Conference
1st International Conference and Exhibition on Device Packaging 2005 - Everything in Electronics Between the Chip and the System; Scottsdale, AZ, United States, 13-16 March, 2005
Note

QC 20140812

Available from: 2014-08-12 Created: 2014-08-08 Last updated: 2014-08-12Bibliographically approved

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
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  • Other locale
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Output format
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  • asciidoc
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