Electrical through-hole and planar interconnect generation in roll-to-roll LED lighting manufacturing using industrial inkjet printheads
2011 (English)In: Mater Res Soc Symp Proc, 2011, 1-6 p.Conference paper (Refereed)
Despite the availability of many high-volume and low-cost manufacturing processes for LED-based lighting applications, relying mainly on fixed patterns such as LED-backlights and RGB-pixelated displays, novel applications, such as "mood lighting" or interior wall displays call for more complicated and shaped LED arrangements. The presented work is based of a novel roll-to-roll (R2R) process to adaptively and cost-efficiently generate LED arrangements on RMPD® substrates. Inkjet printing of planar and though-hole electrical interconnections is of high importance to the process, as it provides a fully digital way of interconnecting devices electrically, accounting for the actual position of the component and spatially provide different ink film thicknesses. Xaar's industrial inkjet printheads are used to dispense defined volumes of 50 pL of a silver nanoparticle ink in order to provide high reliability and good positioning accuracy while maintaining low satellite drop densities. Specific printing strategies are investigated at a print speed of 0.1 m/s to allow for a reliable electrical connection in case of up to 50 μm deep via connections to the buried component. Due to the low glass-transition nature of the underlying substrates, low sintering temperatures are required to preserve the mechanical properties of the substrate. Low temperature oven sintering yielding sufficient conductivity to drive a current of 40 mA will be discussed.
Place, publisher, year, edition, pages
2011. 1-6 p.
, Materials Research Society Symposium Proceedings, ISSN 0272-9172 ; 1340
Electrical connection, Electrical interconnections, High reliability, Ink film, Inkjet printheads, Interconnecting device, LED lighting, Lighting applications, Low sintering temperature, Low temperatures, Manufacturing process, Novel applications, Positioning accuracy, Print speed, Roll to Roll, Satellite drops, Silver nanoparticles, Through hole, Wall displays, Digital devices, Electric connectors, Glass transition, Ink, Lighting, Mechanical properties, Silver, Sintering, Substrates, Thermal printing, Light emitting diodes
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-150599DOI: 10.1557/opl.2011.1270ScopusID: 2-s2.0-84860648989ISBN: 9781618395399OAI: oai:DiVA.org:kth-150599DiVA: diva2:744832
2011 MRS Spring Meeting, 25 April 2011 through 29 April 2011, San Francisco, CA
QC 201409082014-09-082014-09-082014-09-08Bibliographically approved