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Inkjet printing of electrical vias
KTH. XaarJet AB, Sweden.
KTH, School of Industrial Engineering and Management (ITM), Materials Science and Engineering, Engineering Material Physics. XaarJet AB, Sweden.
KTH, School of Information and Communication Technology (ICT), Electronic Systems. XaarJet AB, Sweden.
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2011 (English)In: EMPC - Eur. Microelectron. Packag. Conf., Proc., 2011Conference paper, Published paper (Refereed)
Abstract [en]

Inkjet printing of planar and via (through-hole) electrical interconnections is developed to be incorporated into a roll-to-roll manufacturing line. The specific roll-to-roll machine uses rotary RMPD® technology, self-alignment of bare LED dies, and inkjet printing of the electrical connections to the LEDs dies. The key problem to be solved is the inkjet printing of electrical connections through via holes with vertical walls Xaar126-50pL industrial inkjet printheads were used to print silver nano particle ink at 0.1 m/s to connect through LED vias of 90 μm diameter and up to 50 μm depth. While high throughput sintering techniques are desirable for the specific roll-to-roll machine standard convection oven sintering was applied for the proof of principle described here. Sintering at temperatures as low as 135 °C for 30 min prevented damage to the substrate and LED dies and yielded electrical connections that allowed to drive LEDs with 20 mA at 3V under emission of bright green light.

Place, publisher, year, edition, pages
2011.
Series
EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings
Keyword [en]
electrical via, inkjet printing, silver nano particle ink, Convection oven, Electrical connection, Electrical interconnections, Green light, High throughput, Inkjet printheads, Proof of principles, Roll to roll, Roll to roll manufacturing, Self alignment, Silver-nanoparticles, Through hole, Vertical wall, Via hole, Electric connectors, Ink jet printing, Light emitting diodes, Microelectronics, Nanoparticles, Sintering, Ink
National Category
Materials Engineering Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-150603Scopus ID: 2-s2.0-84857532121ISBN: 9780956808608 (print)OAI: oai:DiVA.org:kth-150603DiVA: diva2:744833
Conference
18th European Microelectronics and Packaging Conference, EMPC-2011, 12 September 2011 through 15 September 2011, Brighton
Note

QC 20140908

Available from: 2014-09-08 Created: 2014-09-08 Last updated: 2016-06-15Bibliographically approved

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Scopushttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6142370&isnumber=6142348

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CiteExportLink to record
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Citation style
  • apa
  • harvard1
  • ieee
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  • vancouver
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More styles
Language
  • de-DE
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  • Other locale
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Output format
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