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CMOS-Integrated Si/SiGe Quantum-Well Infrared Microbolometer Focal Plane Arrays Manufactured With Very Large-Scale Heterogeneous 3-D Integration
KTH, School of Electrical Engineering (EES), Micro and Nanosystems.ORCID iD: 0000-0002-9820-8728
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2015 (English)In: IEEE Journal of Selected Topics in Quantum Electronics, ISSN 1077-260X, E-ISSN 1558-4542, Vol. 21, no 4, 1-11 p.Article in journal (Refereed) Published
Abstract [en]

We demonstrate infrared focal plane arrays utilizing monocrystalline silicon/silicon-germanium (Si/SiGe) quantum-well microbolometers that are heterogeneously integrated on top of CMOS-based electronic read-out integrated circuit substrates. The microbolometers are designed to detect light in the long wavelength infrared (LWIR) range from 8 to 14 mu m and are arranged in focal plane arrays consisting of 384 x 288 microbolometer pixels with a pixel pitch of 25 mu m x 25 mu m. Focal plane arrays with two different microbolometer designs have been implemented. The first is a conventional single-layer microbolometer design and the second is an umbrella design in which the microbolometer legs are placed underneath the microbolometer membrane to achieve an improved pixel fill-factor. The infrared focal plane arrays are vacuum packaged using a CMOS compatible wafer bonding and sealing process. The demonstrated heterogeneous 3-D integration and packaging processes are implemented atwafer-level and enable independent optimization of the CMOS-based integrated circuits and the microbolometer materials. All manufacturing is done using standard semiconductor and MEMS processes, thus offering a generic approach for integrating CMOS-electronics with complex miniaturized transducer elements.

Place, publisher, year, edition, pages
2015. Vol. 21, no 4, 1-11 p.
Keyword [en]
Long-wavelength infrared imaging, LWIR, thermal imaging, uncooled microbolometer, Si/SiGe quantum-wells, wafer-level vacuum packaging, very large-scale heterogeneous 3-D integration, MEMS
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URN: urn:nbn:se:kth:diva-155458DOI: 10.1109/JSTQE.2014.2358198ISI: 000343040800001ScopusID: 2-s2.0-84907855956OAI: diva2:763026
EU, FP7, Seventh Framework Programme

QC 20141113

Available from: 2014-11-13 Created: 2014-11-06 Last updated: 2014-11-13Bibliographically approved

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Forsberg, FredrikRoxhed, NiclasNiklaus, Frank
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