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Lead-free solder cyclic plasticity characterization for drop test simulations
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.), Solid Mechanics (Div.).
2006 (English)In: 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. EuroSimE 2006, 2006Conference paper, Published paper (Refereed)
Abstract [en]

Mechanical behaviour of lead-free solder has been investigated experimentally and thereafter modelled analytically. Material test specimens subjected to uniaxial cyclic loadings at different strain rates exhibit noticeable properties: viscoplasticity, non-linear mixed hardening within each cycle and hardening followed by softening between consecutive cycles. To accurately describe these behaviours, a modified Armstrong and Fredrick model was combined to the Perzyna viscoplastic evolution equation. The set of parameters was determined by both curve-fitting and use of analytical relations. © 2006 IEEE.

Place, publisher, year, edition, pages
2006.
Series
7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006, 2006
Keyword [en]
Cyclic loads, Hardening, Lead compounds, Plasticity, Strain rate, Viscoplasticity, Curve-fitting, Fredrick model, Lead-free solder, Non-linear mixed hardening, Soldered joints
National Category
Mechanical Engineering
Identifiers
URN: urn:nbn:se:kth:diva-155873DOI: 10.1109/ESIME.2006.1644023ISBN: 14244-02751 ISBN: 9781424402755 (print)OAI: oai:DiVA.org:kth-155873DiVA: diva2:763040
Conference
7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006, 24 April 2006 through 26 April 2006, Como
Note

QC 20141113

Available from: 2014-11-13 Created: 2014-11-13 Last updated: 2014-11-13Bibliographically approved

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CiteExportLink to record
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  • apa
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  • de-DE
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