Blueprint and integration of vastly efficient 802.11A WLAN front-end
2006 (English)In: WSEAS Transactions on Electronics, ISSN 1109-9445, Vol. 3, no 4, 258-261 p.Article in journal (Refereed) Published
Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. This paper presents high density multilayer interconnects and integrated passives used to design high performance prototype filter for 5GHz wireless LAN receiver realized on MCM-D substrate. The thin film implementation of Multichip Module technology is identified as a useful platform for the integration of GaAs MMIC and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performance in the microwave frequency regime has now been demonstrated.
Place, publisher, year, edition, pages
2006. Vol. 3, no 4, 258-261 p.
Filter, Front-end, LNA, Microstrip, Multichip, Passives, Receiver, Blueprints, Multichip modules, Semiconducting gallium arsenide, Semiconducting silicon, Semiconductor devices, Signal receivers, Thin films, Wireless telecommunication systems, Integrated passives, Multilayer interconnects, Prototype filter, Local area networks
IdentifiersURN: urn:nbn:se:kth:diva-156353ScopusID: 2-s2.0-33744536848OAI: oai:DiVA.org:kth-156353DiVA: diva2:766496
QC 201411272014-11-272014-11-262015-10-13Bibliographically approved