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Epitaxy and characterization of SiGeC layers grown by reduced pressure chemical vapor deposition
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
2004 (English)Licentiate thesis, comprehensive summary (Other scientific)
Abstract [en]

Heteroepitaxial SiGeC layers have attracted immenseattention as a material for high frequency devices duringrecent years. The unique properties of integrating carbon inSiGe are the additional freedom for strain and bandgapengineering as well as allowing more aggressive device designdue to the potential for increased thermal budget duringprocessing. This work presents different issues on epitaxialgrowth, defect density, dopant incorporation and electricalproperties of SiGeC epitaxial layers, intended for variousdevice applications.

Non-selective and selective epitaxial growth of Si1-x-yGexCy(0≤x≤30, ≤y≤0.02) layershave been optimized by using high-resolution x-ray reciprocallattice mapping. The incorporation of carbon into the SiGematrix was shown to be strongly sensitive to the growthparameters. As a consequence, a much smaller epitaxial processwindow compared to SiGe epitaxy was obtained. Differentsolutions to decrease the substrate pattern dependency (loadingeffect) of SiGeC growth have also been proposed. The key pointin these methods is based on reduction of surface migration ofthe adsorbed species on the oxide. In non-selective epitaxy,this was achieved by introducing a thin silicon polycrystallineseed layer on the oxide. The thickness of this seed layer had acrucial role on both the global and local loading effect, andon the epitaxial quality. Meanwhile, in selective epitaxy,polycrystalline stripes introduced around the oxide openingsact as migration barriers and reduce the loading effecteffectively. Chemical mechanical polishing (CMP) was performedto remove the polycrystalline stripes on the oxide.

Incorporation and electrical properties of boron-doped Si1-x-yGexCylayers (x=0.23 and 0.28 with y=0 and 0.005) with aboron concentration in the range of 3x1018-1x1021atoms/cm3 have also been investigated. In SiGeClayers, the active boron concentration was obtained from thestrain compensation. It was also found that the boron atomshave a tendency to locate at substitutional sites morepreferentially compared to carbon. These findings led to anestimation of the Hall scattering factor of the SiGeC layers,which showed good agreement with theoretical calculations.

Keywords:Silicon germanium carbon (SiGeC), Epitaxy,Chemical vapor deposition (CVD), Loading effect, Highresolution x-ray diffraction (HRXRD), Hall measurements, Atomicforce microscopy (AFM).

Place, publisher, year, edition, pages
Kista: Mikroelektronik och informationsteknik , 2004. , 39 p.
Trita-HMA, ISSN 1404-0379 ; 2004:1
Keyword [en]
Silicon germanium carbon (SiGeC), Epitaxy, Chemical vapor deposition (CVD), Loading effect, High resolution x-ray diffraction (HRXRD), Hall measurements, Atomic force microscopy (AFM).
URN: urn:nbn:se:kth:diva-1718OAI: diva2:7676
Available from: 2004-03-17 Created: 2004-03-17 Last updated: 2012-03-22

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