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Micromachined contactless pin-flange adapter for robust high-frequency measurements
KTH, School of Technology and Health (STH), Centres, Centre for Technology in Medicine and Health, CTMH.ORCID iD: 0000-0002-9327-2544
2014 (English)In: Journal of Micromechanics and Microengineering, ISSN 0960-1317, E-ISSN 1361-6439, Vol. 24, no 8, 084004- p.Article in journal (Refereed) Published
Abstract [en]

We present the first micromachined double-sided contactless WR03 pin-flange adapter for 220-325 GHz based on gap waveguide technology. The pin-flange adapter is used to avoid leakage at the interface of two waveguides even when a gap between them is present and can be fitted onto any standard WR03 waveguide flange. Tolerance measurements were performed with gaps ranging from 30-100 mu m. The performance of the micromachined pin flange has been compared to a milled pin flange, a choke flange and to standard waveguide connections. The micromachined pin flange is shown to have better performance than the standard connection and similar performance to the milled pin flange and choke flange. The benefits of micromachining over milling are the possibility to mass produce pin flanges and the better accuracy in the 2D design. Measurements were performed with and without screws fixing the flanges. The flanges have also been applied to measure two devices, a straight rectangular waveguide of 1.01 inch and a ridge gap resonator. In all cases, the micromachined pin flange performed flawlessly while the standard flange experienced significant losses at already small gaps.

Place, publisher, year, edition, pages
2014. Vol. 24, no 8, 084004- p.
Keyword [en]
GHz, RF MEMS, metamaterial, gap waveguide, high-frequency measurement, pin-flange adapter, micromachining
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
URN: urn:nbn:se:kth:diva-156135DOI: 10.1088/0960-1317/24/8/084004ISI: 000343413400005ScopusID: 2-s2.0-84906080908OAI: diva2:769528
24th MicroMechanics and Microsystems Europe Conference (MME), SEP 01-04, 2013, Espoo, FINLAND
Available from: 2014-12-08 Created: 2014-11-21 Last updated: 2014-12-08Bibliographically approved

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Haasl, Sjoerd
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