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Process development and reliability for system-in-a-package using liquid crystal polymer substrate
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
KTH, Superseded Departments, Microelectronics and Information Technology, IMIT.
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2004 (English)In: Proc Electron Compon Technol Conf, 2004, 24-28 p.Conference paper, Published paper (Refereed)
Abstract [en]

In this study, embedded chip technology for system-in-a-package (SiP) application using liquid crystal polymer (LCP) substrate was developed and the reliability issue for embedded structure was evaluated. To this end two test chips with daisy chain joints were used with one copper layer. After assembly, modules were exposed to thermal cycling. The failure was investigated by SEM, and compared with finite element method (FEM) simulation results. Passive components as inductors were also fabricated on the LCP during the embedded technology. Their inductance and quality factors were simulated and discussed.

Place, publisher, year, edition, pages
2004. 24-28 p.
Series
Proceedings - Electronic Components and Technology Conference, ISSN 0569-5503 ; 1
Keyword [en]
Computer simulation, Copper, Etching, Finite element method, Inductance, Liquid crystal polymers, Microprocessor chips, Permittivity, Photolithography, Reliability, Scanning electron microscopy, Silicon, Thermal cycling, Thermal expansion, Thin films, Wetting, Embedded structures, Flip chip bonding, Photolithography sputtering, Thermal expansion coefficients, Electronics packaging
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-157555ISI: 000224340900004Scopus ID: 2-s2.0-10444287626OAI: oai:DiVA.org:kth-157555DiVA: diva2:771334
Conference
2004 Proceedings - 54th Electronic Components and Technology Conference, 1-4 June 2004, Las Vegas, NV, USA
Note

QC 20141212

Available from: 2014-12-12 Created: 2014-12-11 Last updated: 2014-12-12Bibliographically approved

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Citation style
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