Process development and reliability for system-in-a-package using liquid crystal polymer substrate
2004 (English)In: Proc Electron Compon Technol Conf, 2004, 24-28 p.Conference paper (Refereed)
In this study, embedded chip technology for system-in-a-package (SiP) application using liquid crystal polymer (LCP) substrate was developed and the reliability issue for embedded structure was evaluated. To this end two test chips with daisy chain joints were used with one copper layer. After assembly, modules were exposed to thermal cycling. The failure was investigated by SEM, and compared with finite element method (FEM) simulation results. Passive components as inductors were also fabricated on the LCP during the embedded technology. Their inductance and quality factors were simulated and discussed.
Place, publisher, year, edition, pages
2004. 24-28 p.
, Proceedings - Electronic Components and Technology Conference, ISSN 0569-5503 ; 1
Computer simulation, Copper, Etching, Finite element method, Inductance, Liquid crystal polymers, Microprocessor chips, Permittivity, Photolithography, Reliability, Scanning electron microscopy, Silicon, Thermal cycling, Thermal expansion, Thin films, Wetting, Embedded structures, Flip chip bonding, Photolithography sputtering, Thermal expansion coefficients, Electronics packaging
Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-157555ISI: 000224340900004ScopusID: 2-s2.0-10444287626OAI: oai:DiVA.org:kth-157555DiVA: diva2:771334
2004 Proceedings - 54th Electronic Components and Technology Conference, 1-4 June 2004, Las Vegas, NV, USA
QC 201412122014-12-122014-12-112014-12-12Bibliographically approved