Influence of component position on lead-free solder interconnections during drop test
2005 (English)Conference paper (Refereed)
When subjected to drop test, interconnections between components and test board experience high stresses mainly due to differential bending. Using analytical and numerical modal analysis, bending moments have here been calculated and shown to strongly depend on the location on the test board; the highest value not being found at the centre, as usually stated. In parallel, experiments to determine visco-plastic material properties at high strain rates (∼1s-1) for lead-free solder (SnAgCu) have been performed and used in drop test simulations. Inelastic strains calculated at different locations confirm results from the modal analyses and give a first insight into the development of a drop test failure criterion.
Place, publisher, year, edition, pages
2005. 54-57 p.
, Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005, 1
Computer simulation, Impact testing, Modal analysis, Soldered joints, Stress analysis, Tin alloys, Drop test failure criterion, Drop testing, Lead-free solder, Electric power system interconnection
Other Electrical Engineering, Electronic Engineering, Information Engineering
IdentifiersURN: urn:nbn:se:kth:diva-157088ISI: 000236080200011ScopusID: 2-s2.0-33847127393ISBN: 0780395786ISBN: 9780780395787OAI: oai:DiVA.org:kth-157088DiVA: diva2:771888
7th Electronics Packaging Technology Conference, EPTC 2005; Singapore; Singapore; 7 December 2005 through 9 December 2005
QC 201412152014-12-152014-12-052014-12-15Bibliographically approved