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Influence of component position on lead-free solder interconnections during drop test
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.). Infineon Technologies Sweden AB, Sweden .
KTH, School of Engineering Sciences (SCI), Solid Mechanics (Dept.).ORCID iD: 0000-0002-0307-8917
2005 (English)Conference paper, Published paper (Refereed)
Abstract [en]

When subjected to drop test, interconnections between components and test board experience high stresses mainly due to differential bending. Using analytical and numerical modal analysis, bending moments have here been calculated and shown to strongly depend on the location on the test board; the highest value not being found at the centre, as usually stated. In parallel, experiments to determine visco-plastic material properties at high strain rates (∼1s-1) for lead-free solder (SnAgCu) have been performed and used in drop test simulations. Inelastic strains calculated at different locations confirm results from the modal analyses and give a first insight into the development of a drop test failure criterion.

Place, publisher, year, edition, pages
2005. 54-57 p.
Series
Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005, 1
Keyword [en]
Computer simulation, Impact testing, Modal analysis, Soldered joints, Stress analysis, Tin alloys, Drop test failure criterion, Drop testing, Lead-free solder, Electric power system interconnection
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-157088ISI: 000236080200011Scopus ID: 2-s2.0-33847127393ISBN: 0780395786 (print)ISBN: 9780780395787 (print)OAI: oai:DiVA.org:kth-157088DiVA: diva2:771888
Conference
7th Electronics Packaging Technology Conference, EPTC 2005; Singapore; Singapore; 7 December 2005 through 9 December 2005
Note

QC 20141215

Available from: 2014-12-15 Created: 2014-12-05 Last updated: 2014-12-15Bibliographically approved

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Gudmundson, Peter

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Bonnaud, Etienne L.Gudmundson, Peter
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