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Layer Manufacturing as a Generic Tool for Microsystem Integration
2007 (English)In: 4M 2007, Third International Conference on Multi-Material Micro Manufacture, 2007Conference paper, Published paper (Refereed)
Abstract [en]

Nearly every microsystem application requires specific packaging solutions. In this paper we suggest a newapproach to use layer manufacturing as a generic tool for microsystem integration. Three different methods to produce3D electrical interconnects are presented. Ink jet printing is used for the ceramic layer manufacturing process, as well asfor the printing of silver for circuit patterns. The technique is demonstrated for an Inertial Measurement Unit(IMU)platform. A four-sided pyramid was manufactured with layer manufacturing in ceramics and four gyroscopes weremounted on the sides of the pyramid. A demonstrator with three light diodes was also manufactured to demonstrate thepossibility to produce 3D electrical interconnects in the volume of the pyramid.

Place, publisher, year, edition, pages
2007.
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:kth:diva-91784ISBN: 1-904445-53-5 (print)ISBN: 978-1-904445-53-1 (print)ISBN: 1-4200-7004-5 (print)ISBN: 978-1-4200-7004-0 (print)OAI: oai:DiVA.org:kth-91784DiVA: diva2:784917
Conference
4M 2007, Third International Conference on Multi-Material Micro Manufacture : 3 - 5 October 2007, Borovets, Bulgaria
Note

QC 20150417

Available from: 2015-01-31 Created: 2012-03-20 Last updated: 2015-04-17Bibliographically approved

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Haasl, Sjoerd

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